Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging
Global Sourcing Spotlight: The New Landscape of Manufacturing 
EIPC Summer Conference 2025: Call for Distinguished Speakers in Edinburgh
March 26, 2025 | EIPCEstimated reading time: Less than a minute
The European Institute of Printed Circuits (EIPC) is pleased to announce its Summer Conference 2025, scheduled for June 3-4 in the historic city of Edinburgh, Scotland. The EIPC is seeking distinguished speakers to contribute to this premier event, which will gather industry experts, innovators, and thought leaders for 1.5 days of in-depth lectures and discussions on cutting-edge topics in the PCB industry.
The conference will cover a wide range of critical areas, including PCB design, modeling, simulation, manufacturing technology, AI computing, environmental responsibility and eco-friendly manufacturing, reliability, and traceability by application. EIPC welcomes speakers who can provide valuable insights and expertise in these fields.
Edinburgh, the capital of Scotland, offers a unique and inspiring setting for the conference. With its rich historical and cultural heritage, world-class universities, and thriving technological sector, the city provides an ideal environment for fostering innovation and collaboration.
The EIPC invites industry professionals to share their knowledge and contribute to the success of the Summer Conference 2025.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Neways Begins Delivery of Saab’s UTAAS Integrated Sight and Fire Control Systems
02/11/2026 | NewaysNeways, the global innovator in mission-critical technology for semicon, defense & mobility, and connectivity sectors, has started production and delivery of critical sub-systems for Saab’s UTAAS (Universal Tank and Anti-Aircraft System) integrated sight and fire control systems for BAE Systems’ CV90 infantry fighting vehicles.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Google’s High-Speed Interconnect Architecture to Push 800G+ Optical Transceiver Share Past 60% by 2026
02/10/2026 | TrendForceGoogle’s next-generation TPU, Ironwood, integrates a 3D Torus network topology with the Apollo optical circuit switch (OCS) all-optical network, marking a major step forward in AI data-center interconnect design.
Qnity Introduces First Ceria PCMP Clean for Advanced, Sustainable Semiconductor Manufacturing
02/09/2026 | QnityQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, introduced its first post-chemical mechanical planarization (PCMP) cleaning solution designed specifically for ceria applications.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/06/2026 | Nolan Johnson, I-Connect007Here’s the thing about time travel. You can’t just manipulate the time dimension; you have to move in three-dimensional space as well. That’s because Earth orbits a star, which orbits a galaxy, which is on its own path through three-dimensional space. Our planet follows a complex corkscrew-like path through the universe, covering great distances in just seconds. Build a time machine like HG Wells envisioned, and even a short jump in time means that Earth has moved, and you’re now floating in the void of space. Unsettling, to be sure.