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Hon Hai Research Institute Partners with Taiwan Academic Research Institute and KAUST to Participate in CLEO 2025

05/30/2025 | Foxconn
The research team of the Semiconductor Division of Hon Hai Research Institute, together with the research teams of National Taiwan University and King Abdullah University of Science and Technology in Saudi Arabia, has successfully made breakthroughs in multi-wavelength μ -LED technology to achieve high-speed visible light communication and optical interconnection between chips.

Rocket Lab Enters Payload Market with Agreement to Acquire Geost

05/28/2025 | BUSINESS WIRE
Rocket Lab Corporation, a global leader in launch services and space systems, today announced the signing of a definitive agreement to acquire the parent holding company of Geost, LLC (Geost).

AI Boom Drives Surge in Data Center Interconnect Demand; Global Market Value to Grow 14.3% in 2025

05/19/2025 | TrendForce
TrendForce reports that leading global telecom providers such as SK Telecom and Deutsche Telekom are rolling out Agentic AI services for general users as generative AI becomes increasingly integrated into daily life in 2025.

Koh Young Installs 24,000th Inspection System at Top 20 EMS

05/14/2025 | Koh Young
Koh Young, the global leader in True 3D measurement-based inspection and metrology solutions, proudly announces the installation of its 24,000th inspection system at a Top 20 Global EMS in Thailand.

Corning Collaborates with Broadcom to Accelerate AI Data Center Processing Capacity

05/14/2025 | BUSINESS WIRE
Corning Incorporated, a world leader in glass science and optical physics, today announced a collaboration with Broadcom Incorporated, a leading supplier in the semiconductor field, on a co-packaged optics (CPO) infrastructure that will significantly increase processing capacity within data centers.
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