Indium to Showcase Proven EV Products and High-Reliability Alloys at Productronica China

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As a global materials supplier and trusted partner in electric vehicle (EV) and e-Mobility manufacturing, Indium Corporation® is proud to showcase its high-reliability alloys and soldering solutions at Productronica China, March 26-28, in Shanghai, China.

With 10 years of expertise in EV manufacturing and more than 10 million electric vehicles using its advanced materials, Indium Corporation will showcase its Rel-ion™ product suite. These products offer reliable electrical, mechanical, and thermal solutions designed to accelerate manufacturers’ time to market. Rel-ion™ material solutions enhance reliability by:

• Eliminating non-wet opens and head-in-pillow defects
• Preventing dendritic growth by meeting stricter surface insulation resistance requirements
• Preventing solder delamination with precise bondline control and increased creep and fatigue resistance
• Reducing hot spots-induced voiding through improved thermal efficiency

Indium Corporation will focus on the following featured products:

• Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It is ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior thermal cycling and drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and it even outperforms SAC305 with optimal process setup.
• Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.

In addition, Indium Corporation will showcase the following products of high-reliability materials powering sustainability:

• Indalloy®301LT for Preforms/InFORMS® is a novel Pb-free alloy that enables lower reflow processing temperatures compared to SAC alloys, preventing delamination and reducing warpage in package-attach soldering applications.
• InTACK® is a no-clean, no residue, halogen-free adhesive solution developed for holding parts in place during placement and reflow processes.
• Durafuse® HT is an innovative Pb-free solution designed to deliver a high-temperature lead-free (HTLF) paste for discrete power electronics devices. Durafuse® HT can “drop in” to the current high-Pb die-attach paste process, with no special equipment needed. Functional performance and thermal cycling reliability are both equal to or higher than a high-Pb solder.
• Heat-Spring®  is a compressible, non-reflow metal TIM ideal for TIM2 applications. These indium-containing TIMs offer superior thermal conductivity over non-metals, with pure indium metal delivering 86W/mK in all planes. Because of its solid metal state, Heat-Spring® avoids pump-out and bake-out problems. It also offers a sustainable solution due to the company’s indium reclaim and recycle program.
• InFORCE™ is a series of high-reliability pressure sinter pastes, offering copper and silver formulations with excellent thermal conductivity. Optimized for printing, large-area sintering, and low-temperature processing, they offer innovative solutions for advanced die-attach and package applications.