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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Ouster, Benchmark Expand Partnership to Scale REV8 Lidar Production

06/18/2026 | Benchmark
Ouster, Inc., a leader in sensing and perception for Physical AI, and Benchmark Electronics, Inc., a global provider of manufacturing, engineering, and technology services, announced the expansion of their long-term manufacturing partnership to support the high-volume production of Ouster's new Rev8 OS sensor family for industrial, robotics, automotive, and smart infrastructure applications.

TTM Achieves AEC-Q200 Qualification for Mini-Xinger® RF Product Portfolio

06/17/2026 | Globe Newswire
TTM Technologies, Inc. announced that its Mini-Xinger® product portfolio has achieved AEC-Q200 qualification accreditation, a significant milestone validating the product line’s conformance to the highest standards of passive component reliability for automotive and high-reliability applications.

NOR Flash, SLC NAND Prices Surge Over 100% in 1H26, Shortages to Persist in 2H26

06/16/2026 | TrendForce
Major memory suppliers continue to prioritize capacity allocation toward higher-value products such as HBM and advanced-layer 3D NAND, according to TrendForce’s latest research on the memory industry.

Advanced Packaging: A Central Axis of Innovation in A&D, Automotive

06/11/2026 | I-Connect007 Editorial Team
Presenters in the Aerospace & Defense Special Session at APEX EXPO 2026 made one message abundantly clear: Advanced packaging has moved from a supporting role to a primary system enabler, particularly in high-reliability markets where performance, longevity, and environmental resilience are non-negotiable. The March Technical Conference at APEX EXPO focused on advanced electronics for the first time this year, with two Special Sessions featuring a carefully curated selection of presentations examining how design priorities, material choices, and manufacturing strategies are evolving in response to these demands.

GlobalFoundries Completes Acquisition of Synopsys’ Processo

06/03/2026 | GlobalFoundries
GlobalFoundries announced the completion of its previously announced acquisition of Synopsys’ ARC Processor IP Solutions business.
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