-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
U.S. Tariffs to Curb Investment and Consumption Momentum; 2025 Global End-Market Outlook Downgraded
April 8, 2025 | TrendForceEstimated reading time: 2 minutes
On April 2nd, the U.S. announced a new round of reciprocal tariffs, followed by a provision allowing exemption for goods with more than 20% “U.S. value”. TrendForce’s latest observations reveal that the lack of macroeconomic improvement since 2024, coupled with the inflationary and recessionary risks posed by these new tariffs, has prompted a downward revision of the 2025 shipment outlook for several end-device markets—including AI servers, servers, smartphones, and notebooks.
Stronger-than-expected shipments of servers, smartphones, and notebooks in 1Q25 were largely driven by brands advancing shipments to the U.S. ahead of the new tariff implementation. TrendForce notes that supply chain players are still evaluating how to absorb increased production costs. Whether U.S. value will be assessed based on brand nationality or manufacturing origin remains a key point of concern for the industry.
TrendForce presents two revised forecast scenarios: In the base case, the 20% U.S. value is interpreted as brand-based—meaning American brands are more likely to secure exemptions for complete systems or finished products. In the worst case, retaliatory tariffs from other countries escalate the trade war, and the U.S. value is defined strictly based on the manufacturing location, which significantly increases the risk of market contraction.
In the AI server segment, the base case assumes partial tariff relief through the U.S. value exemption, while Mexico—being excluded from the tariff list—remains a strategic re-export hub for ODMs serving U.S. clients under the USMCA agreement. However, ongoing political and economic uncertainty may cause OEMs and CSPs to adopt a more cautious procurement approach. Consequently, TrendForce has slightly lowered its 2025 AI server shipment growth forecast to 24.5% YoY.
Under the worst case, escalating tariffs could trigger global inflation and erode consumer spending power. This would likely lead CSPs and OEMs to further delay investments in AI servers, reducing the annual shipment growth rate to around 18%.
For the server segment, pressures from U.S. tariffs are expected to constrain corporate CapEx, leading to more conservative IT budgets in the second half of 2025. Full-year server shipment growth forecast is thus trimmed to 5.4%. In the worst case, the global supply chain would face higher costs and investment hesitancy if tariffs expand to include semiconductors and core computing components, driving server shipment growth down to 2%.
TrendForce also notes that a more lenient interpretation of the 20% U.S. value rule would allow mid- to high-end smartphones to qualify for exemptions, whereas low-end or entry-level models may still be impacted. Amid widespread consumer uncertainty, value-for-money purchases will become more prominent. In the base case, 2025 global smartphone production is projected to be flat YoY. In the worst case, production may decline by 5% YoY.
PC OEMs began pulling forward shipments to the U.S. as early as 4Q24 in preparation for potential tariffs. After the announcement on April 2nd, U.S. brands with established assembly operations in Southeast Asia continued shipping as planned, while non-U.S. brands adopted a wait-and-see approach. With macroeconomic uncertainty expected to suppress both consumer and commercial upgrade demand, TrendForce now forecasts 2025 global notebook ODM shipment growth to slow to 3% under the base case and to 2% in the worst case.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).