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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
Thank you, Columnists
This month, we give thanks to our columnists—the brilliant minds who share their expertise, experiences, and passion for the PCB industry. Meet the people behind the pages, learn what drives them, and discover their personal stories.
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Industry Voices Highlighted in the April 2025 Issue of PCB007 Magazine
April 15, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Can you hear the voices?
Tariffs, CapEx spending, the war in Ukraine, and domestic and global economies: We were curious about what’s on industry leader’s minds as we launch headlong into Q2 2025. Therefore, in the April 2025 issue of PCB007 Magazine, we highlight voices from the industry, how they feel about their businesses, the effects of a new U.S. administration, and where technology is heading. We hear from leaders within PCB manufacturing—TTM, CEE PCB, Alpha Circuit, Accurate Circuit Engineering, and NCAB—as well as leadership among their suppliers, including Pluritec, Ventec, and Schmoll America. Our contributors discuss a broad range from strategy and growth, being nimble and resilient, and creating strength in the supply chain. Their answers provide an enlightening glimpse into where our industry finds itself right now and for the remainder of 2025.
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"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
USPAE Grants ‘Greater Access’ to Defense Electronics Manufacturers
01/20/2026 | Nolan Johnson, I-Connect007Chris Peters, co-founder of the U.S. Partnership for Assured Electronics and expert on manufacturing supply chains, recently announced he would be stepping back from his role. I first met Chris in the spring of 2020, when SMT007 Magazine interviewed him for the July 2020 issue. I was pleased that Chris took the time to reflect on the USPAE, past present and future, and his optimism is infectious.
American Made Advocacy: How Congress Can Restore the U.S. Printed Circuit Board Industry
01/20/2026 | Shane Whiteside -- Column: American Made AdvocacyIn 2026, the global PCB industry will see strong growth driven by data centers and the global race to create the most powerful artificial intelligence, along with the increased sophistication and production scale manufacturing of defense and infrastructure systems. Automotive technology innovations, the acceleration of unmanned systems production, and the continued proliferation of smart devices are also among the market forces driving global demand for microelectronics in general and PCBs in particular.
Symposium Review: A Glimpse Into the Future of IC Substrates and Beyond
01/19/2026 | Edy Yu, Editor-in-Chief, ECIOThe Hong Kong Printed Circuit Association (HKPCA) and the Korea Printed Circuit Association (KPCA), with strong support from SEMI, presented “The Future of IC Substrates and Beyond Symposium 2025” at the Sands Expo and Convention Centre in Singapore in . The event brought together elite professionals, technical experts, and corporate leaders from across the global IC substrate industry chain to explore cutting-edge trends and innovative solutions shaping the future of the sector.
Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1
01/19/2026 | Vern Solberg -- Column: Designer's NotebookThe development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.
Advanced Electronic Packaging: How the Global Electronics Association Is Addressing Challenges and Needs in Malaysia
01/19/2026 | Devan Iyer and Matt Kelly, Global Electronics AssociationIn November, more than 200 industry leaders, including government officials, regional domestic companies, multinational companies, and academic experts, gathered at the Olive Tree Hotel in Penang for the Advanced Electronic Packaging (AEP) Workshop, organized by the Global Electronics Association. With 15 expert speakers, three technical tracks, three expert panel discussions, and strong ecosystem participation, the workshop highlighted why advanced electronic packaging is central to the future of Malaysia’s semiconductor industry.