-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Elephantech: For a Greener Tomorrow
April 16, 2025 | Marcy LaRont, PCB007 MagazineEstimated reading time: 3 minutes

Nobuhiko Okamoto is the global sales and marketing manager for Elephantech Inc., a Japanese startup with a vision to make electronics more sustainable. The company is developing a metal inkjet technology that can print directly on the substrate and then give it a copper thickness by plating. In this interview, he discusses this novel technology's environmental advantages, as well as its potential benefits for the PCB manufacturing and semiconductor packaging segments.
Marcy LaRont: Nobu, can you explain this process of inkjet metallization?
Nobu Okamoto: We directly print on the substrate and then add the plating to reduce the etching and washing process for flexible printed circuit (FPC) production or rigid PCB production. We have already succeeded for three years in mass production and commercializing the single-layer FPC. I think this is a very rare case in printed electronics to have already been commercialized and succeeded.
At the end of last year, we successfully created a sample of multilayer FR-4. We are now looking for a partner to collaborate with on this project. Additionally, this technology can also be adapted for use with aluminum or glass substrates.
LaRont: So, is this for PCBs and some semiconductor packaging technology as well?
Okamoto: This is very fortunate because after we developed it for PCB manufacturing, we found that our printer, our ink, can print over glass, aluminum, or ceramics. Many customers are asking us, "Can you print on ceramic?” or "Can you print on glass?” because they are looking for many things, not just for the PCB. They are especially looking for semiconductor packaging or other applications. We are expanding our target customers and trying to solve the various customer requirements.
LaRont: What is the difference between copper, aluminum, and ceramic glass? Is there trouble with adhesion?
Okamoto: For the moment, the whole material complies with IPC standards. As I mentioned, we are trying to make electronics sustainable; that's why we are providing the solutions. We can develop different solutions for other requirements. This may include a different ink, printer, or primer.
LaRont: If a customer has a request, you want to partner with them to create a solution?
Okamoto: Yes, but we are a very small company, so we would like a real partner. For my part, I would appreciate some testing or something similar. It can be quite challenging, but if businesses are facing issues and would like to resolve them using our technology, we are always open to collaboration.
LaRont: That's really important. If you want to add value in electronics manufacturing today, you really have to be in that space where you'll partner with your customers on NPI and such.
Okamoto: Until today, it's been quite difficult because our biggest advantage is sustainability. Everybody says that sustainability is very important, but it's really tough to make decisions, especially in the FPC and PCB areas. We have already established a net-zero target internally, and the European side is expressing concerns about this. This is a good time to consider implementing this manufacturing method, which typically takes two to three years. It’s an excellent opportunity to aim for a target year of 2030 or 2035.
LaRont: I agree that everybody's talking about it but having trouble doing it. If you know anything about inkjet technology, you know there's a lot less waste and so much less copper. What are the sustainability benefits of your technology?
Okamoto: We don't have any washing and etching process so we can reduce water consumption by 95%. No etching means fewer chemical contaminants. As a result, we can reduce 75% CO2 emissions.
LaRont: That's quite a lot of green right there.
Okamoto: Also, many people consider green technology expensive, but copper and water are very expensive resources now. With our technology, you can reduce copper by 70%, so your manufacturing costs should be lower.
LaRont: We're approaching the point where it will be just as costly not to do it.
Okamoto: The advantage of our technology is we use 100% of the copper ink and the copper plating, so it can be possible to directly replace what our customers are using now. There's no compromise.
LaRont: Requalification is one thing, but there’s no need to redesign?
Okamoto: No need to redesign.
LaRont: Nobu, it sounds like exciting technology. Hopefully we'll hear more about it in the future.
Okamoto: Thank you very much.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
CEE PCB Launches PCBpedia: A New Knowledge Hub for Circuit Board Technology
09/03/2025 | CEE PCBCEE PCB, a leading manufacturer of PCBs and FPCs, is responding to the growing demand for reliable technical knowledge. With PCBpedia, CEE introduces a new knowledge platform featuring expert articles on key topics in circuit board technology – from FPC design rules to surface finishes.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.
Nordson Reports Q3 Fiscal 2025 Results and Updates Full Year Guidance
08/21/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal third quarter ended July 31, 2025. Sales were $742 million compared to the prior year’s third quarter sales of $662 million.
Haylo Labs Acquires Plessey Semiconductors
08/20/2025 | Haylo LabsHaylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.
SoftBank Group and Intel Corporation Sign $2B Investment Agreement
08/19/2025 | Intel CorporationSoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.