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YINCAE to Showcase Cutting-Edge Solutions at SEMICON Southeast Asia 2025
April 16, 2025 | YINCAEEstimated reading time: Less than a minute
YINCAE Advanced Materials, a leading provider of innovative solutions for the semiconductor and microelectronics industries, is proud to announce its participation in SEMICON Southeast Asia 2025. This premier event for the semiconductor and microelectronics sector will take place from May 20-22, 2025, at the Sands Expo and Convention Center in Singapore. YINCAE will be showcasing its latest advancements at booth #B2939.
Attendees are invited to visit YINCAE’s booth to explore the company’s cutting-edge innovations in board-level assembly materials, underfill, die attach adhesives, wafer-level materials, optoelectronic materials, and thermal interface materials. YINCAE’s team of experts will be available to discuss how its solutions address the evolving needs of the semiconductor and microelectronics market, with applications spanning automotive, military, aerospace, consumer electronics, telecommunications (e.g., 5G/6G), and AI.
“SEMICON Southeast Asia is a pivotal event for connecting with key stakeholders in the region’s semiconductor ecosystem,” said YINCAE’s CEO “We are excited to showcase our latest innovations and collaborate with customers to develop solutions that drive the semiconductor industry forward.”
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