Defense Speak Interpreted: Is There Still a CHIPS Act?
Beyond the Board: Empowering the Next Generation of Tech Innovators in Electronics
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
KOKI Announces Upcoming Webinar on Solder Voiding – Causes and Remedies
April 16, 2025 | KOKIEstimated reading time: Less than a minute
KOKI, a global leader in advanced soldering materials and process optimization services, is pleased to announce its upcoming webinar, “Solder Voiding—Causes and Remedies,” which will take place on Tuesday, April 22, 2025, at 12:00 PM CDT. Jerome McIntyre, Regional Sales & Applications Engineer at KOKI Americas, will present this live session.
Solder voiding is a persistent issue in electronic assembly, often impacting the reliability and performance of solder joints. While some degree of voiding is considered acceptable depending on the application, excessive voids can significantly compromise mechanical strength, electrical continuity, and thermal dissipation. In this webinar, McIntyre will explore the root causes of solder voiding and discuss key factors that influence void formation. Attendees will gain valuable insights into how material selection and process adjustments can help reduce voids and improve overall solder joint quality.
Designed for engineers, manufacturers, and industry professionals, this session offers practical strategies for optimizing soldering processes and ensuring greater product reliability.
Registration is now open.
Share on:
Suggested Items
BEST Inc. Introduces StikNPeel Rework Stencil for Fast, Simple and Reliable Solder Paste Printing
06/02/2025 | BEST Inc.BEST Inc., a leader in electronic component rework services, training, and products is pleased to introduce StikNPeel™ rework stencils. This innovative product is designed for printing solder paste for placement of gull wing devices such as quad flat packs (QFPs) or bottom terminated components.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
INEMI Interim Report: Interconnection Modeling and Simulation Results for Low-Temp Materials in First-Level Interconnect
05/30/2025 | iNEMIOne of the greatest challenges of integrating different types of silicon, memory, and other extended processing units (XPUs) in a single package is in attaching these various types of chips in a reliable way.
E-tronix Announces Upcoming Webinar with ELMOTEC: Optimizing Soldering Quality and Efficiency with Robotic Automation
05/30/2025 | E-tronixE-tronix, a Stromberg Company, is excited to host an informative webinar presented by Raphael Luchs, CEO of ELMOTEC, titled "Optimize Soldering Quality and Efficiency with Robotic Automation," taking place on Wednesday, June 4, 2025 at 12:00 PM CDT.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.