Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
The Marketing Minute: Cracking the Code of Technical Marketing
Laird Thermal Systems Announces Max Kley as New CEO
April 18, 2025 | Laird Thermal SystemsEstimated reading time: 1 minute
Laird Thermal Systems (LTS) is pleased to announce the appointment of Dr. Max Kley as its new Chief Executive Officer, effective April 1, 2025. Max Kley brings a wealth of international leadership experience to LTS, having successfully led and developed businesses across the USA, Europe, and Asia.
With a distinguished career spanning multiple industries—including medical, industrial and energy—Mr. Kley has held various key leadership positions. He served as the CEO of Freudenberg Medical Group for six years and most recently was CEO of Freudenberg e-Power Systems, a global leader in alternative energy systems.
In addition to his executive roles, Mr. Kley’s extensive experience with global brands equips him with the expertise and leadership necessary to guide LTS into its next phase of growth. His proven track record of fostering innovation and driving organizational development will be instrumental in expanding LTS’s offerings and broadening its leading position in the market.
Tony Quinlan, Chairman of the Advisory Board of Laird Thermal Systems, said: “I would like to welcome Max Kley to the Laird Thermal Systems leadership team. He is an exceptional leader with global industry expertise and a proven track record of delivering enhanced performance. He has continuously demonstrated an ability to drive quality and innovation in fast-evolving markets, strengthen operations and foster customer-centric cultures. He joins a strong business which is well primed for the next phase of growth.”
Dr. Max Kley said, “Driving the future development of Laird Thermal Systems as the leading global provider of sustainable thermal management solutions is an exciting and very appealing task. Its technical expertise, outstanding track record and global footprint make LTS the partner of choice for demanding, mission-critical cooling applications. I am excited to join the LTS team and shape the company’s continued success.”
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
VIDEOTON EAS's Bulgarian Subsidiary Expands Into Automotive Products
09/15/2025 | VideotonVEAS Bulgaria, engaged in electronics manufacturing, has joined the ranks of VIDEOTON companies authorized to produce automotive products.
Variosystems Strengthens North American Presence with Southlake Relaunch 2025
09/15/2025 | VariosystemsVariosystems celebrated the relaunch of its U.S. facility in Southlake, Texas. After months of redesign and reorganization, the opening marked more than just the return to a modernized production site—it was a moment to reconnect with our teams, partners, and the local community.
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).