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Advanced Electronics Packaging Digest

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Circuit Mind Announces $25M in Funding to Accelerate the Rise of Electronic Design Intelligence

10/28/2026 | Globe Newswire
 Circuit Mind, the AI platform that enables enterprise electronics teams to automatically design, verify, and optimize circuit boards, announced $25 million in new financing, bringing its total funding to $33.4 million.

Intel to Acquire Classiq to Create a Full-stack Quantum Computing Platform

10/28/2026 | Intel
 Intel Corporation announced that it has entered into a definitive agreement to acquire Classiq, a leading provider of quantum computing software. The combination of Classiq’s synthesis platform with Intel’s spin-qubit manufacturing and existing software would create a user-friendly full-stack quantum computing platform, enabling the promising technology to mature into a mainstream computing business.

What Scares Me Today in PCB and System Design

10/28/2026 | Stephen V. Chavez, Siemens EDA and PCEA
After more than 30 years in PCB design, I have seen our industry evolve from relatively straightforward circuit boards to highly complex, high-density, high-speed electronic systems that push the limits of physics, materials, manufacturing processes, and engineering capabilities. I have worked across multiple design disciplines, tackled difficult technical challenges, and watched the tools and technologies available to engineers advance dramatically.

ChipAgents Expands Full-Stack Agentic AI Across Digital and Analog Chip Design

10/27/2026 | BUSINESS WIRE
ChipAgents, the category leader in agentic AI platforms for semiconductor design, announced the expansion of its AI-native engineering platform across digital and analog chip design, bringing more of the semiconductor development flow onto a shared agentic foundation.

Siemens Expands NVIDIA AI Collaboration for 3D IC Power and Thermal Challenges

10/27/2026 | Siemens
Siemens announced an expansion of its EDA agentic AI portfolio, developed in collaboration with NVIDIA.
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