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Real Time with... IPC APEX EXPO 2025: TRI Innovation—Transforming Semiconductor Inspection with AI Technology
April 25, 2025 | Real Time with...IPC APEX EXPOEstimated reading time: Less than a minute

Nolan Johnson talks with David Chiu, USA Sales Manager for TRI Innovation. TRI uses advanced technology to tackle challenges in inspecting tiny components. Their AI programming reduces coding time by 75%, enhancing efficiency in inspections. Collaborating with Nvidia, TRI integrates GPU technology to improve product development and encourages customers to share data for better AI performance.
The 25th IPC APEX EXPO, March 18-20, 2025, at the Anaheim Convention Center in California, has concluded successfully. If you couldn’t make it to the show, don’t worry—the I-Connect007 team has coverage of the entire week’s events. Don’t miss our Real Time with… IPC APEX EXPO 2025 video interviews with the movers and shakers of the electronics industry.
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"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
AI Infrastructure Boosts Global Semiconductor Revenue Growth to 17.6% in 2025
09/09/2025 | IDCAccording to the Worldwide Semiconduct o r Technology and Supply Chain Intelligence service from International Data Corporation (IDC), worldwide semiconductor revenue is expected to reach $800 billion in 2025, growing 17.6% year-over-year from $680 billion in 2024. This follows a strong rebound in 2024, when revenue grew by 22.4% year-over-year.
Akrometrix Announces Next Generation Thermal Warpage Measurement Tool the PS600T
09/05/2025 | Akrometrix LLCAkrometrix, LLC, the leading provider of Thermal Warpage and Strain Metrology Equipment for semiconductor and electronics industries, recently announced the next generation in thermal warpage metrology with its PS600T system.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
TRI's AI-Powered Inspection Solutions at SMTAI 2025
09/02/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems, will be joining the SMTA International Exposition & Conference. The event will be held from October 21 – 23, 2025, at the Donald E. Stephens Convention Center in Rosemont, IL, USA.
Target Condition: Floor Planning Without a Floor
08/27/2025 | Kelly Dack -- Column: Target ConditionBy a show of hands, how many PCB designers have been asked to start a layout without a board outline, keep-out zones, or even height constraints? How many have had to work within a specific enclosure before the schematic was finalized? If this sounds familiar, you're not alone. Starting a PCB layout without critical constraints is like hiring an interior designer to buy furniture and carpet for a house you haven’t even purchased yet, or, even worse, trying to fit four bedrooms' worth of furniture in a one-room cabin.