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NEXT Semiconductor Technologies Collaborates with BAE Systems to Develop Next Generation Space-Qualified Chips
April 28, 2025 | PRNewswireEstimated reading time: 1 minute

NEXT Semiconductor Technologies is collaborating with BAE Systems to accelerate the insertion of its latest ultra-wideband antenna processor units (APUs) into high-performing radiation-hardened electronic subsystems to support future space missions. NEXT's APUs combine agile signal acquisition and generation with on-board high-reliability, reconfigurable digital processing that offer unprecedented quantity, quality and efficiency of information processing for next generation satellite sensors and transmitters. This effort will enable efficient and resilient wideband RF (radio-frequency) signal processing capabilities not yet available to the space market.
NEXT's latest APU, the NX450, is the world's first 200 GS/s (200 billion samples per second) antenna processor with 100-GHz of instantaneous RF bandwidth split across four independent receive and transmit channels respectively. The NX450 simplifies sensor design by pushing signal digitization and processing closer to the edge – redefining electronic warfare capabilities while reducing sensor SWaP (size, weight, and power). The NX450 is manufactured in an onshore GlobalFoundries 12LP (12 nanometer) FinFET process, features embedded application processor redundancy and has been radiation tested for space qualification.
As satellite networking proliferates, the demand for both greater data payloads and on-orbit processing is driving the advancement of System-on-Chip (SoC) solutions such as APUs that define the capabilities and performance of satellite antenna systems. The NX450 is the first device of its kind to address the emerging demands for secure wide bandwidth satellite communication (SATCOM).
"NEXT is firmly entrenched in the development of high-reliability, software-defined SoC solutions for next generation satellite payloads. We are eager to collaborate with BAE Systems to address future space missions with our unique SoC capabilities," said Mike Kappes, President and Chief Strategy Officer at NEXT Semiconductor.
BAE Systems will provide support of the NX450 APU for use in proliferated low-Earth orbit missions. The company may also work with NEXT to incorporate its own application specific integrated circuit technology and expertise for use in future SoC products. These next-generation, radiation-hardened solutions are the key enabler of wide bandwidth capabilities in demanding space environments.
"By leveraging our decades of space electronics experience, we can apply our radiation-hardened techniques to a commercial off-the-shelf product to deliver a new capability addressing our space customers' needs," said Jim LaRosa, Space Systems program director at BAE Systems. "Our collaboration with NEXT allows for the development of future solutions with dramatically increased mission and environmental performance."
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Julia McCaffrey - NCAB GroupSuggested Items
Honeywell-Led Consortium Receives UK Government Funding to Revolutionize Aerospace Manufacturing
09/02/2025 | HoneywellA consortium led by Honeywell has received UK Government funding for a project that aims to revolutionize how critical aerospace technologies are manufactured in the UK through the use of AI and additive manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/29/2025 | Nolan Johnson, I-Connect007This week, we bring you Global Electronics Association’s Chris Mitchell’s government relations column on—you guessed it—trade deals. TTM is balancing its facilities between East and West. The Global Electronics Association released July numbers for North American PCB shipments, and the news is good. Meanwhile, the corresponding report for EMS might seem like bad news, but that’s misleading. Be sure to look deeper for the rest of the story. Finally, for a bit space-science palate cleansing, I’m sharing news of the latest launch of NASA’s X-37B.
Boeing-built X-37B Spaceplane Launches, Beginning Eighth Mission
08/26/2025 | BoeingThe Boeing-built X 37B Orbital Test Vehicle launched its eighth mission, lifting off aboard a SpaceX Falcon 9 from Kennedy Space Center, Florida. The vehicle is healthy on orbit and proceeding with standard checkout.
TI Semiconductors Enable Advanced Earth-observation Capabilities of ISRO’s First-of-its-kind NISAR Mission
08/25/2025 | Texas InstrumentsTexas Instruments (TI) semiconductors are enabling the radar imaging and scientific exploration payloads for the NASA-Indian Space Research Organization (ISRO) synthetic aperture radar (NISAR) satellite, which was recently launched into orbit.
Rocket Lab Announces Expanded U.S. Investments for National Security Programs and Semiconductor Manufacturing
08/25/2025 | BUSINESS WIRERocket Lab Corporation, a global leader in launch services and space systems, announced it is boosting its U.S. investments to expand semiconductor manufacturing capacity and provide supply chain security for space-grade solar cells and electro-optical sensors for national security space missions.