It’s Only Common Sense: Selling Without Selling
Dan’s Biz Bookshelf: ‘The Art of Going SLOW’
Happy’s Tech Talk #39: PCBs Replace Motor Windings
SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
May 5, 2025 | SEMIEstimated reading time: 1 minute
SEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
Europe’s premier event connecting the entire electronics design and manufacturing supply chain, SEMICON Europa 2025 will gather industry experts and innovators to explore how international collaboration is driving technological innovation, economic resilience, and sustainability across Europe’s semiconductor ecosystem. The exhibition and conference will be co-located with productronica.
Call for Abstracts
Advanced Packaging Conference (APC) ─ Key Enabler for System Performance
Advanced packaging technologies—including 2.5D and 3D stacking, chiplet integration, and heterogeneous packaging—are revolutionizing system performance by delivering greater processing power and energy efficiency. Innovations in advanced materials and interconnects are further reducing signal loss and latency, enabling high-performance computing and AI at scale. Abstracts are invited on key topics including advanced materials and processes for packaging, power and thermal management in 2.5D/3D packaging, packaging innovations for silicon photonics, and testing inspection and metrology.
MEMS & Imaging Sensors Summit ─ Industry Meets Innovative Ideas
Entrepreneurs, startups, graduates, and newcomers will showcase their research and early-stage products. Topics of interest include new applications and use cases for MEMS and sensors, advancements in technology and materials, smart MEMS and AI integration, MEMS-photonics co-integration, alternative imaging sensor architectures, and foundry offers for start-ups.
Pre-recorded Innovation Presentations ─ Global Collaborations for European Economic Resilience
SEMI Europe will also highlight microelectronics and semiconductors innovations in short pre-recorded messages, pitches and product announcements that will be aired on SEMICON Europa 2025 main stages during networking sessions and on the final day of the exhibition. Projects of interest include sustainability and green technologies, diversity and inclusion, semiconductor advancements in aerospace, defense and automotive applications, as well as smart manufacturing, cybersecurity and more.
Presentation abstracts, biographies, and headshots must be submitted in English through the SEMICON Europa 2025 Call for Abstracts portal by Friday, June 20, 2025. Selected presenters will be notified in August 2025.
Share on:
Suggested Items
Zuken Vitech Announces GENESYS 2025: Advancing Interoperability and Usability in Model-Based Systems Engineering
06/10/2025 | ZukenZuken Vitech, a leading provider of model-based systems engineering (MBSE) solutions, is proud to announce the release of GENESYS 2025, the latest evolution of its flagship systems engineering platform.
Airbus Signs Contract to Equip German Air Force A400Ms with Infrared Protection Systems
06/09/2025 | AirbusAirbus has been awarded a contract from the German procurement agency Bundesamt für Ausrüstung, Informationstechnik und Nutzung der Bundeswehr (BAAINBw) to equip 23 Luftwaffe A400Ms with DIRCM protection systems.
Plexus Issues Fiscal 2024 Sustainability Report
06/06/2025 | PlexusPlexus Corp. released its fiscal 2024 Sustainability Report. The report, which is now available on the company’s Sustainability web page, highlights how Plexus’ commitment to sustainability and innovating responsibly is rooted in its values.
Siemens Announces PAVE360 Support for New Arm Zena Compute Subsystems
06/04/2025 | Siemens Digital Industries SoftwareSiemens Digital Industries Software announced today that it is expanding its longstanding relationship with Arm and adding support for the newly launched Arm® Zena™ Compute Subsystems (CSS) in its PAVE360™ software, designed for software-defined vehicles (SDV).
IPC Releases Latest Standards and Revisions Updates
06/05/2025 | IPCEach quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.