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New Database of Materials Accelerates Electronics Innovation
May 5, 2025 | ACN NewswireEstimated reading time: 2 minutes
In a collaboration between Murata Manufacturing Co., Ltd., and the National Institute for Materials Science (NIMS), researchers have built a comprehensive new database of dielectric material properties curated from thousands of scientific papers. The study, published in Science and Technology of Advanced Materials: Methods, also offers insights that could accelerate the development of next-generation electronic materials and energy storage technologies.
Large-scale dielectric materials database built with the open database project "Starrydata" and generation of a materials map using machine learning-based data visualization.Large-scale dielectric materials database built with the open database project "Starrydata" and generation of a materials map using machine learning-based data visualization.
AI-driven materials discovery has great potential to accelerate innovation, but it relies on large and diverse datasets. The lack of such data remains a major bottleneck in the field. To address this challenge, researchers used the Starrydata2 web system to collect experimental data on over 20,000 material samples from more than 5,000 publications. The NIMS team has developed a standardized approach to extract data from graphs, including temperature-dependent properties, which are often omitted in other databases. "What makes our work unique is the meticulous process of manually tracing graphs and correcting inconsistencies in original research papers to create a clean, high-quality dataset," the researchers said.
The database focuses on a specific class of materials necessary for electronics and is the largest ever reported, significantly surpassing previous collections. With this wealth of information, the team used machine learning (ML) to predict the properties of materials and how they would behave electronically.
Although the ML models were effective, they initially worked as "black boxes" — the researchers couldn’t see why the models made their predictions. To understand the context for predictions, the team created visual maps of the data, making complex information easier to interpret. They used clustering algorithms to automatically group similar materials. This analysis helped them spot patterns in how a material's composition affects its properties. The team was also able to categorize the materials into distinct groups, including seven important ferroelectric families, providing a global landscape of the entire compositional space.
The team took a closer look at ABO3 Perovskites, a family of materials which are essential components in everyday electronic devices and energy storage technologies, such as smartphones, computers, and solar cells. Their visualizations showed a simple link between the basic structure of the material and its dielectric permittivity, which coincides with previous academic knowledge.
This work advances our understanding of dielectric materials and moves research beyond traditional trial-and-error approaches. "By curating the largest dataset as ever and combining various machine-learning methods, we succeeded in visualizing the landscape of the entire compositional space in unprecedented detail," the team explained.
The NIMS team plans to make the dataset publicly available next year, allowing scientists worldwide to leverage it for new discoveries. Future work may involve expanding data collection to include manufacturing methods and processing conditions, allowing for more comprehensive predictions that would link production processes to material properties.
"We hope that this foundational work will inspire similar data collection initiatives and new approaches to materials discovery, ultimately leading to smarter materials development pathways that benefit society through improved electronic technologies," the researchers concluded.
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Brent Fischthal - Koh YoungSuggested Items
Creating a Design Constraint Strategy
07/24/2025 | I-Connect007 Editorial TeamMost designers learn how to set their design constraints through trial and error. EDA vendors’ guidelines explain how to use their particular tools’ constraints, and IPC standards offer a roadmap, but PCB designers usually develop their own unique styles for setting constraints. Is there a set of best practices for setting constraints? That’s what I asked Global Electronics Association design instructor Kris Moyer, who covers design constraints in his classes.
Meet the Author: Beth Turner Explores Encapsulating Sustainability for Electronics
07/23/2025 | I-Connect007In a special Meet the Author edition of On the Line with…, host Nolan Johnson welcomes Beth Turner, senior technical manager at MacDermid Alpha Electronics Solutions. Beth is the author of The Printed Circuit Assembler’s Guide to… Encapsulating Sustainability for Electronics.
The Pulse: Design Constraints for the Next Generation
07/17/2025 | Martyn Gaudion -- Column: The PulseIn Europe, where engineering careers were once seen as unpopular and lacking street credibility, we have been witnessing a turnaround in the past few years. The industry is now welcoming a new cohort of designers and engineers as people are showing a newfound interest in the profession.
Copper Price Surge Raises Alarms for Electronics
07/15/2025 | Global Electronics Association Advocacy and Government Relations TeamThe copper market is experiencing major turbulence in the wake of U.S. President Donald Trump’s announcement of a 50% tariff on imported copper effective Aug. 1. Recent news reports, including from the New York Times, sent U.S. copper futures soaring to record highs, climbing nearly 13% in a single day as manufacturers braced for supply shocks and surging costs.
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (DuPont's electronics business), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.