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Global Semiconductor Sales Increase 18.8% in Q1 2025 Compared to Q1 2024; March 2025 Sales up 1.8% MoM
May 6, 2025 | SIAEstimated reading time: Less than a minute
The Semiconductor Industry Association (SIA) announced global semiconductor sales were $167.7 billion for the first quarter of 2025, an increase of 18.8% compared to the first quarter of 2024 but 2.8% less than the fourth quarter of 2024. Global sales were $55.9 billion during the month of March 2025, an increase of 1.8% compared to the February 2025 total of $54.9 billion. Monthly sales are compiled by the World Semiconductor Trade Statistics (WSTS) organization and represent a three-month moving average. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“Global semiconductor demand remains high, with first-quarter sales substantially outpacing the first quarter of last year,” said John Neuffer, SIA president and CEO. “Year-to-year sales increased by more than 17% for the 11th consecutive month, driven by a year-to-year sales increase of roughly 45% in the Americas.”
Regionally, year-to-year sales in March were up in the Americas (45.3%), Asia Pacific/All Other (15.4%), China (7.6%), and Japan (5.8%), but down in Europe (-2.0%). Month-to-month sales in March increased in Europe (5.7%), Asia Pacific/All Other (3.6%), and China (2.4%), but decreased in the Americas (-0.4%) and Japan (0.4%).
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Atg-Luther Maelzer to Exhibit at APEX EXPO 2026
03/09/2026 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH and their partner International Electronic Components Inc (IEC) are looking forward to meeting with attendees at the upcoming IPC-APEX trade show in booth 4844 on March 17 – 19 at the Convention Center in Anaheim, CA.
STMicroelectronics Expands Silicon Photonics Production for AI Demand
03/09/2026 | STMicroelectronicsSTMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, is now entering high-volume production for its state-of-the-art silicon photonics-based PIC100 platform used by hyperscalers for optical interconnect for data centers and AI clusters.
YINCAE's TM230D Introduced: Innovative 3-in-1 Solderable Adhesive
03/06/2026 | YINCAEA breakthrough in advanced packaging materials has arrived with the introduction of TM230D, an innovative 3-in-1 sintering material designed to simplify processing while delivering exceptional thermal & reliability performance for next-generation power electronics & high-performance semiconductor applications.
SolderKing Expands Solder Paste Range with SAC0307 Low-Silver Alloy Option
03/05/2026 | SolderKingSolderKing Assembly Materials has launched SAC0307, a new low-silver addition to its SK P2-5 solder paste range.
KOKI Showcases BIG Low-Ag and ICT-ready Solutions at APEX EXPO 2026
03/05/2026 | KOKIKOKI Solder America, a global leader in advanced soldering materialsannounces that it will be exhibiting at APEX EXPO 2026, taking place March 17–19 at the Anaheim Convention Center in Anaheim, California.