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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
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ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
May 6, 2025 | ZESTRONEstimated reading time: Less than a minute
ZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service. From design to high-volume production and field deployment, this service provides comprehensive support across the entire value chain. Utilizing advanced precision tools and expert analysis to identify potential risks early, address vulnerabilities, and optimize processes to prevent costly failures.
From design to early-stage, the team collaboratively reviews products, processes, and materials to identify potential vulnerabilities. Reliability and endurance testing verify compliance with customer quality benchmarks and industry standards, ultimately accelerating time to market, minimizing risks, and enhancing product reliability.
Led by Dr. Denis Barbini and utilizing ZESTRON’s global resources, the team offers root cause and failure mode analysis for die-level components, PCBAs, and full enclosures. By identifying root causes, the analytical approach provides essential evidence for product liability claims or vendor returns, helping to reduce future failure costs and ensuring your assemblies perform consistently throughout their lifecycle.
Suggested Items
PCBAIR Invests in AI to Enhance Defect Prediction in PCB Manufacturing
04/11/2025 | PRNewswirePCBAIR, a leading provider of PCB manufacturing and assembly services with fully automated production lines, announced that it is increasing funding for research and development to incorporate AI into its manufacturing processes, dramatically improving defect prediction accuracy and efficiency.
PGZ, Safran to Pursue Further Cooperation
04/01/2025 | SafranPolska Grupa Zbrojeniowa S.A. and Safran, a French high-technology group and major player in aerospace and defense, have signed a Memorandum of Understanding to jointly pursue further business opportunities as part of European defense industry cooperation efforts.
Scanfil Is Preparing for a Changing Trading Environment
03/19/2025 | ScanfilAs the potential for new tariffs continues to evolve, Scanfil is committed to ensuring that its global manufacturing network is prepared to offer support should the need arise for a shift of manufacturing locations, whether domestically or internationally.
Cicor Bids to Acquire Part of Éolane France
03/06/2025 | CicorCicor Group announces that the discussions with the company Éolane France and relevant governmental authorities regarding a potential acquisition of selected Éolane France businesses, as mentioned in Cicor's media statement of 22 January 2025, have reached an advanced stage. A public offer has been submitted.
Javelin Joint Venture Explores Production Opportunities in India
02/18/2025 | Lockheed MartinThe Javelin Joint Venture (JJV) is exploring future co-assembly and co-production opportunities of the Javelin anti-tank weapon system in India through a competitive source selection process with potential Indian partners.