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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Connecting Quality, Traceability, and Manufacturing Processes

09/09/2026 | Scott Ryan, Cetec ERP
Traceability is easy to describe and difficult to maintain. From the moment a component arrives, its supplier lot, inspection results, certificates, and eventual use in production have to be captured and carried forward into the finished assembly and shipment. Every step creates and requires information. In EMS and PCB assembly, products involve thousands of components, multiple levels of subassemblies, customer-specific requirements, revision changes, and supplier documents arriving in any number of formats. This becomes infinitely more difficult when quality, inventory, production, and document management live in separate systems.

Zuken Launches E3.series 2027 With Expanded Engineering and Manufacturing Capabilities

09/08/2026 | Zuken
Zuken announced E3.series 2027, the latest release of its electrical design software for wiring, wire harness, fluid, and control systems design.

Yunlin County, Foxconn Launch 'Document Brain' Smart Service

09/01/2026 | Foxconn
The Yunlin County Government and Foxconn Technology Group announced that they have jointly developed the "Document Brain" smart agent service, which has completed its initial phase and achieved fruitful results in improving the efficiency of government administration.

CONFIDEE Successfully Recertified to AS9120

08/31/2026 | CONFIDEE
CONFIDEE has successfully completed its AS9120 recertification, confirming that our quality management system continues to meet the strict requirements of the aviation, space and defence industries.

Standards: The Roadmap for Your Ideal Data Package

05/29/2025 | Andy Shaughnessy, Design007 Magazine
In this interview, IPC design instructor Kris Moyer explains how standards can help you ensure that your data package has all the information your fabricator and assembler need to build your board the way you designed it, allowing them to use their expertise. As Kris says, even with IPC standards, there’s still an art to conveying the right information in your documentation.
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