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Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design

02/16/2026 | Cadence Design Systems
Cadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.

American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias

02/13/2026 | American Standard Circuits
American Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.

Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion

02/13/2026 | Astera Labs, Inc.
Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

02/13/2026 | Michelle Te, I-Connect007
This week, I’ve taken some extra time to better learn some video and photo editing software programs we use at I-Connect007. You’ll want to check out my LinkedIn video to see how I brought my avatar to life for this week’s must-reads! The items I’m highlighting this week are also about learning something new, from Pete Starkey’s thorough three-day review of the EIPC Winter Conference in Aix-en-Provence, France, to what’s on the horizon for advanced electronics packaging. I also share details about the new Design Village at APEX EXPO 2026, preview a new column from Remtec’s Chandra Gupta, and discuss why marketing isn’t a one-and-done deal.
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