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Imec Coordinates EU Chips Design Platform
May 9, 2025 | ImecEstimated reading time: 1 minute
A consortium of 12 European partners, coordinated by imec, has been selected in the framework of the European Chips Act to develop the EU Chips Design Platform. Funded by Chips JU, the platform will facilitate access to advanced semiconductor design infrastructure, training, and capital for fabless semiconductor startups, small and medium enterprises and research organizations. By providing the necessary resources, the initiative aims to democratize and foster semiconductor innovation across Europe, specifically for chip design.
The semiconductor industry is the backbone of modern technology, powering everything from smartphones to advanced medical devices. With the EU Chips Act, Europe is dedicated to increasing its global semiconductor market share. Next to the launch of European pilot lines that aim to develop key technologies for semiconductor innovation, the EU Chips Act has proposed the EU Chips Design Platform as a vehicle to support the growth of fabless chip companies in Europe.
The EU Chips Design Platform will enable fabless companies to access the resources they need quickly and efficiently via a cloud-based virtual environment, offering chip design resources, training, and capital. Coordinated by imec, twelve key European research players in the semiconductor ecosystem have joined forces in a consortium to create this design platform.
The platform aims to onboard the first startups and small and medium enterprises by early 2026, providing them with low-barrier access to European design capabilities, including route-to-chip fabrication, packaging, and testing. It will offer customized support to access commercial electronic design automation (EDA) tools, intellectual property (IP) libraries, EU Chips Act pilot line technologies, and access to design IP repositories, including open-source options. Additionally, the platform will feature a startup support program with incubation, acceleration, and mentoring activities next to financial assistance to help early-stage companies turn their innovative ideas into reality.
“The EU Chips Design Platform will provide crucial resources for startups and SMEs to accelerate their design journey and bring their business ideas to market faster. By reducing the barriers to access of design expertise, including EDA tools and IP, and drastically lowering chip design and fabrication costs and time-to-market, we will spark the growth of the European chip design industry,” stated Romano Hoofman, imec project coordinator.
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Connect the Dots: Sequential Lamination in HDI PCB Manufacturing
07/31/2025 | Matt Stevenson -- Column: Connect the DotsAs HDI technology becomes mainstream in high-speed and miniaturized electronics, understanding the PCB manufacturing process can help PCB design engineers create successful, cost-effective designs using advanced technologies. Designs that incorporate blind and buried vias, boards with space constraints, sensitive signal integrity requirements, or internal heat dissipation concerns are often candidates for HDI technology and usually require sequential lamination to satisfy the requirements.
Target Condition: The 5 Ws of PCB Design Constraints
07/29/2025 | Kelly Dack -- Column: Target ConditionHave you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.