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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Summit Interconnect Names Milan Shah as Vice Chairman of the Board
August 26, 2025 | Summit Interconnect, Inc.Estimated reading time: Less than a minute
Summit Interconnect, a leading provider of advanced PCB manufacturing, today announced that Milan Shah has been named Vice Chairman of the Board. Shah is a seasoned industry leader and former owner of Royal Circuit Solutions and Advanced Assembly, which were both acquired by Summit in 2022. As Vice President of Commercial Markets, Shah’s role included operations, customer engagement, capital investment, and input into company strategy.
“Over the past three years, Milan has made a tremendous impact at Summit, and the Board and I have come to value his insights, energy, industry connections, and vision,” said Shane Whiteside, CEO and Chairman of the Board. “His promotion to Vice Chairman will allow him to help guide Summit’s success and the future of PCB manufacturing.”
“I’m honored to take on this role as Vice Chairman,” said Milan Shah. “I care deeply about Summit, our talented team, our partners, and the industry we support. My passion is tackling challenges head-on and removing obstacles so we can continue to grow by delivering lasting value for our customers.”
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Simon Khesin - Schmoll MaschinenSuggested Items
Summit Interconnect Marks 10 Years of Precision Manufacturing
04/03/2026 | Summit Interconnect, Inc.Summit Interconnect, the largest privately held printed circuit board (PCB) manufacturer in North America, marks its tenth anniversary, a milestone that reflects a decade of bold acquisitions, pioneering technology investments, and an enduring mission: to enable customer success through the highest-reliability PCB manufacturing on the continent.
My Top 7 Takeaways from APEX EXPO 2026
04/03/2026 | Chris Mitchell, VP of Global Government Relations, Global Electronics AssociationI’m back from APEX EXPO 2026 in Anaheim, California, and it was another great year. Even amid significant global volatility, the industry is growing, innovating, and building partnerships. As I reflect on the experience, I want to share my top 7 takeaways and explain why each matters. First is this year’s Advanced Electronics Packaging Conference (AEPC) , which delivered outstanding, peer-reviewed content and strong participation, reflecting how central advanced electronics packaging has become across the industry.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
02/27/2026 | Marcy LaRont, I-Connect007 MagazineIt’s time for my five must-reads featured this past week. The global economy is still reeling from last Friday’s U.S. Supreme Court ruling that most tariffs imposed under IEEPA by President Trump are unconstitutional. In other news, with APEX EXPO just two weeks away, we're featuring the first three Real Time with... pre-show sponsor interviews: Remtec, Burkle North America, and KYZEN. These are insightful and forward-thinking interviews about what you can expect to see at the show this year. Please check them out!
Growing an Engineer: Meet Emerging Engineer Julian Vega
02/25/2026 | Marcy LaRont, I-Connect007 MagazineJulian Vega started as a 17-year-old intern who rose to planning supervisor at Summit Interconnect in just seven years, and credits the Global Electronics Association’s Emerging Engineer program for fueling his passion and accelerating his career journey. In this interview, Julian shares how the program expanded his technical perspective, connected him with industry leaders, and helped shape his vision for the future.
Siemens Wins Best of Show Award for ‘Packaging: Design’ at 2026 Chiplet Summit
02/23/2026 | SiemensSiemens has won in the “Packaging: Design” category at the 2026 Chiplet Summit Best of Show Awards for its Innovator3D IC™ solution.