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Chase Corporation Acquires Sheldahl

06/15/2026 | PR Newswire
Chase Corporation, a leading global provider of engineered materials for high-reliability applications, today announced it has acquired Sheldahl from Flex. Sheldahl designs and manufactures specialized coated films, laminates, and flexible circuit technologies for aerospace, automotive, industrial, and medical markets.

Rethinking Resilience: How Electronic Component Recovery Is Reshaping the Supply Chain

06/11/2026 | Rob Ronan, Retronix Ltd.
The first article in this series explored how semiconductor shortages exposed the fragility of global supply chains. But shortages are only one part of a broader challenge. The electronics supply chain has always been complex, but in recent years it has become something else entirely: unpredictable. From pandemic-driven disruptions to geopolitical tensions and sudden demand spikes, manufacturers have been forced to confront the hard truth that traditional sourcing strategies are no longer enough.

Defense Speak Interpreted: Extreme Financial Disparity in Drones and Missiles

06/09/2026 | Dennis Fritz -- Column: Defense Speak Interpreted
There has been a lot of publicity about the cost of U.S. weapons used in the Iran conflict since it started on Feb. 28. Several aspects of the conflict deserve attention to explain extreme financial disparity. Iran uses both drones and missiles. In particular, Iran’s Shahed drones are a family of Iranian-designed UAVs primarily known for their widespread use as cost-effective, one-way "kamikaze" (suicide) attack munitions. Drones have become a disruptive force in modern warfare by overwhelming expensive air defense systems with low-cost mass deployment.

Trouble in Your Tank: The Role of Organic Solderability Preservatives in Advanced Packaging

06/08/2026 | Michael Carano -- Column: Trouble in Your Tank
Technology trends shaping the electronics industry supply chain—AI, IoT, ADAS, and high-performance computing (HPC)—are driving finer circuit features and higher layer counts. Advanced packaging drives the selection of surface finishes depending on the application. Typical designs require excellent solder joint reliability and wire bondability. It is not uncommon for designers to specify the organic solderability preservatives (OSP) on the BGA side of the substrate and precious-metal-plated finishes on the top side, which facilitate wire bonding.

Will Gutierrez Joins Technica USA in West South-Central Territory

06/02/2026 | Technica USA
Technica USA is pleased to announce the hiring of Will Gutierrez as Business Development/Account Manager responsible for the West South-Central Territory. Will shall be responsible for all PCBA, Substrate and PCB related sales activities and customer support throughout Texas, Oklahoma, Arkansas and Louisiana operating from the state of Texas.
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