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For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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In Pursuit of Perfection: Defect Reduction—May 2025 PCB007 Magazine Now Available
May 15, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
In Pursuit of Perfection (Reducing Defects)
For bare PCB board fabrication, reducing defects is largely equivalent to a company's bottom line profitability.
Since bare printed circuit board fabrication involves many complex processing steps—from the preparation of materials to the etching of copper and the creation of vias and pads—there is much that can go wrong if processes are not tightly controlled.
This is especially true as technology becomes smaller and more challenging, with even “minor” things affecting a product’s long-term reliability. “Passing” in the shop doesn’t necessarily avert field failures down the line.
In the May 2025 issue of PCB007 Magazine, we examine the imaging, etching, and plating processes, as well as product traceability on the shop floor, providing information and insight into how you can reduce your defects and increase yields.
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EIPC Summer Conference 2025: PCB Innovation in Edinburgh
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