-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueAdvancing the Advanced Materials Discussion
Moore’s Law is no more, and the advanced material solutions to grapple with this reality are surprising, stunning, and perhaps a bit daunting. Buckle up for a dive into advanced materials and a glimpse into the next chapters of electronics manufacturing.
Inventing the Future With SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
May 16, 2025 | Globe NewswireEstimated reading time: 2 minutes
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
According to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”
Growth of the Flexible PCB Market Driven by Demand for Miniaturized Electronics and Automotive Systems
Rising adoption of miniaturized, lightweight, and high-performance electronics in various application industries is boosting growth of the market for Flexible PCB Market. Compact and flexible circuits increasingly come into play in consumer electronics like smartphones, wearables and foldable devices. Moreover, rising penetration of electric vehicles (EVs) and ADAS in the automotive industry is increasing the utilization of flexible PCBs that provide enhanced signal integrity, lightweight material, and durability in complex automotive modules. U.S. Flexible PCB Market is expected to reach USD 1.80 Billion by 2023, at a CAGR of 13.53%.
Flexible PCB Market Growth by Type and End Use Key Trends and Projections
By Type
Double-sided FPCBs held the largest market share in 2023 at 44.3%, providing highly sophisticated circuitry This would result in cost-effective, spatially-efficient circuit design. They are more complicated to manufacture than single-sided boards, but can be lean enough to be mass-produced on a budget, lending them scrutiny in consumer electronics, automotive, and other industries.
Multilayer FPCBs, expected to grow at the highest CAGR from 2024 to 2032, are developed to address the need for miniaturization, high electrical performance and stability in compact electronics, such as mobile phones, medical, aerospace, and 5G devices. These boards allow for more features and reliability, satisfying the demand for more miniaturization in the industry, even under conditions of narrow installation.
By End Use
In 2023, the Consumer Electronics segment led the Flexible PCB market with a 51.3% share, as a result of the high demand for flexible and lightweight circuits solutions in devices such as smartphones, tablets, laptops, smartwatches and similar wearable devices. Consumer electronic devices have continued to minimize and aggregated while evolution to smarT terminals more increased FPCB demands.
The IT & Telecom segment is expected to register the fastest growth from 2024 to 2032, n account of 5G infrastructure expansion, investments in data centers and rising demand for high-speed communication equipment.
Flexible PCB Market Growth in Asia Pacific and North America
In 2023, Asia Pacific dominated the Flexible PCB market with a 74.7% share, driven by a robust manufacturing ecosystem and leading electronics producers like China, Japan, South Korea, and Taiwan. Major companies such as Samsung Electronics, Sony, and Foxconn rely heavily on flexible PCBs for devices like smartphones, smartwatches, and display modules. Additionally, increasing demand for electric vehicles and wearable devices in the region is fueling market growth, positioning Asia Pacific as both a production hub and a major consumer.
North America is expected to experience the highest CAGR from 2024 to 2032, on account of progress in 5G, aerospace, defense, and medical applications. Businesses of Lockheed Martin and Raytheon Technologies are increasingly adopting rigid-flex PCBs in defense systems, and companies of Cisco and Qualcomm are spurring demand for high-performance FPCBs in telecom and IoT equipment. Increasing R&D spends and high end applications are projected to drive the market in the region.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).