Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
NEDME 2025 Announces Diverse and Distinguished Speaker Lineup
May 19, 2025 | ASC SunstoneEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is thrilled to announce the impressive speaker lineup for the upcoming 2025 event. Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center in Hillsboro, Oregon, NEDME 2025 will feature a dynamic array of thought leaders from across the electronics design and manufacturing sectors.
Keynote and Featured Speakers
- James Clarke - Director of Quantum Hardware, Intel Corporation
- Lupita Maurer - President, Polar Instruments
Session and Panel Speakers
- Kevin Beattie - Production Manager, ASC Sunstone Circuits
- Debbie Benke - Director of Quality Assurance, Axiom Electronics
- Dr. Isil Berkun - Founder, DigiFab AI
- Pat Duggan - Sales Engineer and Distribution Manager, Temco Northwest
- Mike Galloway - Sr. Manufacturing Engineer, Screaming Circuits
- Darren Hitchcock - Sr. Business Development Manager, Panasonic Electronic Materials
- Jim Kaigh - Outsourced VP of Growth, Sales Xceleration
- Gregory Kovsky - President, International Business Associates (IBA)
- Brandon Patton - President, Lakehouse Industries
- Gabrielle Proust - Principal, The Efficiency Godmother
- Mike Schindele - Director of Operations, DZYNE Technologies
- Mark Veary - Director of Engineering, Fusion EMS
- Jerry Vieira - President & Founder, The QMP Group
- Justin Wagner - Patent Attorney, McCoy Russell LLP
- Blaine Watson - Director, designPORT
- Leonard Weitman - Principal Consultant, Weitman Consulting
- Angela Wilhelms - President & CEO, Oregon Business & Industry (OBI)
- Laura Zager - Director, IP Counsel for Software and AI, Thermo Fisher Scientific
Event Details
- Date: Wednesday, October 22, 2025
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, Hillsboro, OR
Exhibitor Registration: Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now. Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics sector.
For more information and to secure your spot, visit www.nedme.com.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Imec Launches 300mm GaN Program to Develop Advanced Power Devices and Reduce Manufacturing Costs
10/13/2025 | ImecImec, a world-leading research and innovation hub in nanoelectronics and digital technologies, welcomes AIXTRON, GlobalFoundries, KLA Corporation, Synopsys, and Veeco as first partners in its 300mm gallium-nitride (GaN) open innovation program track for low- and high-voltage power electronics applications.
Renesas Powers 800 Volt Direct Current AI Data Center Architecture with Next-Generation Power Semiconductors
10/13/2025 | RenesasRenesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced that it is supporting efficient power conversion and distribution for the 800 Volt Direct Current power architecture announced by NVIDIA, helping fuel the next wave of smarter, faster AI infrastructure.
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.