NEDME 2025 Announces Diverse and Distinguished Speaker Lineup
May 19, 2025 | ASC SunstoneEstimated reading time: 1 minute
The Northwest Electronics Design & Manufacturing Expo (NEDME) is thrilled to announce the impressive speaker lineup for the upcoming 2025 event. Taking place on Wednesday, October 22, 2025, at the Wingspan Event & Conference Center in Hillsboro, Oregon, NEDME 2025 will feature a dynamic array of thought leaders from across the electronics design and manufacturing sectors.
Keynote and Featured Speakers
- James Clarke - Director of Quantum Hardware, Intel Corporation
- Lupita Maurer - President, Polar Instruments
Session and Panel Speakers
- Kevin Beattie - Production Manager, ASC Sunstone Circuits
- Debbie Benke - Director of Quality Assurance, Axiom Electronics
- Dr. Isil Berkun - Founder, DigiFab AI
- Pat Duggan - Sales Engineer and Distribution Manager, Temco Northwest
- Mike Galloway - Sr. Manufacturing Engineer, Screaming Circuits
- Darren Hitchcock - Sr. Business Development Manager, Panasonic Electronic Materials
- Jim Kaigh - Outsourced VP of Growth, Sales Xceleration
- Gregory Kovsky - President, International Business Associates (IBA)
- Brandon Patton - President, Lakehouse Industries
- Gabrielle Proust - Principal, The Efficiency Godmother
- Mike Schindele - Director of Operations, DZYNE Technologies
- Mark Veary - Director of Engineering, Fusion EMS
- Jerry Vieira - President & Founder, The QMP Group
- Justin Wagner - Patent Attorney, McCoy Russell LLP
- Blaine Watson - Director, designPORT
- Leonard Weitman - Principal Consultant, Weitman Consulting
- Angela Wilhelms - President & CEO, Oregon Business & Industry (OBI)
- Laura Zager - Director, IP Counsel for Software and AI, Thermo Fisher Scientific
Event Details
- Date: Wednesday, October 22, 2025
- Time: 8:00 AM – 4:00 PM
- Location: Wingspan Event & Conference Center, Hillsboro, OR
Exhibitor Registration: Companies looking to showcase their latest products, services, and innovations are invited to secure booth space now. Exhibiting at NEDME provides a unique opportunity to connect with key decision-makers, engineers, and industry professionals in the electronics sector.
For more information and to secure your spot, visit www.nedme.com.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Indium Corporation Introduces New Flip-Chip Flux for Semiconductor Devices
07/31/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier, today announced the global availability of WS-910 Flip-Chip Flux, a new water-soluble flip-chip dipping flux designed to meet the demands of cutting-edge semiconductor devices.
FlashPCB Enhances SMT Production Line with Heller 1809 Reflow Oven and KIC ProBot
07/31/2025 | FlashPCBFlashPCB, a leading provider of quick-turn PCB assembly, has expanded its surface mount production capabilities with the installation of a Heller 1809 MKII reflow oven paired with the KIC ProBot automatic profiling system. This addition supports FlashPCB’s goal of achieving faster throughput, higher quality assurance, and consistent process control across a wide range of PCB builds.
KOKI to Showcase Analytical Services and New HF1200 Solder Paste at SMTA Guadalajara 2025
07/31/2025 | KOKIKOKI, a global leader in advanced soldering materials and process optimization services, will exhibit at the SMTA Guadalajara Expo & Tech Forum, taking place September 17 & 18, 2025 at Expo Guadalajara, Salón Jalisco Halls D & E in Guadalajara, Mexico.
Federal Electronics Mexico Boosts Speed and Flexibility with New Mycronic A40DX Pick-and-Place
07/23/2025 | Federal ElectronicsFederal Electronics, a leader in providing advanced electronic manufacturing services, has announced a major upgrade at its Hermosillo, Mexico facility with the installation of a Mycronic MYPro A40DX Pick-and-Place system, advancing its surface mount assembly capabilities for high-reliability electronics manufacturing.
DuPont Publishes 2025 Sustainability Report
07/22/2025 | PRNewswireDuPont published its 2025 Sustainability Report detailing the progress made toward achieving its 2030 Sustainability Goals.