SMTA Symposium on Counterfeit Parts & Materials Program Finalized
May 21, 2025 | SMTAEstimated reading time: 1 minute
The SMTA is pleased to announce the technical program for the Symposium on Counterfeit Parts & Materials. Co-organized by SMTA and the Center for Advanced Life Cycle Engineering (CALCE), the event will be held June 24-26, 2025 in Hyattsville, Maryland at the College Park Marriott Conference Center.
The technical program includes two semiconductor-focused keynote presentations. Other sessions will address trusted sources, technology, testing/accreditation, global perspectives, legal/policy issues, independent distributor concerns, and machine learning standards.
Matthew Hicks, Sr. Director of Foundries, Test & Advanced Packaging (FTAP) at Northrop Grumman, will provide the opening keynote presentation on Tuesday, June 24, 2025. Hicks’ presentation is titled, “Microelectronics Powering America's Defense.”
Chuck Woychik, NHanced Semiconductors, will keynote the second day of the symposium with his presentation, “A Global View Versus a U.S. Focus on Outsourced Assembly and Test (OAST) Facilities to Support Wafer-Level Packaging.”
The symposium concludes on Thursday, June 26, with three professional development courses. A full-day course titled “Counterfeit Parts Detection Using SAE AS6171”, is instructed by Michael Azarian, Ph.D., CALCE, University of Maryland. Peter Sandborn, Ph.D., instructs a concurrent half-day course in the morning titled, “Electronic Part Obsolescence Forecasting, Mitigation and Management.” Diganta Das, Ph.D., CALCE, University of Maryland, will instruct the afternoon course titled, “Use of Component Documentation and Supply Chain for Counterfeit Avoidance.
Registration for this event is now open. Discounted rates are available when registering by Friday, May 23. Access to the two-day symposium and professional development courses are included in the standard conference package, details are available on the registration page.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
SEMI Reports Global 300mm Fab Equipment Spending Expected to Total $374 Billion Over Next Three Years
10/09/2025 | SEMIGlobal 300mm fab equipment spending is expected to reach $374 billion from 2026 to 2028, SEMI reported today in its latest 300mm Fab Outlook.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
Datest Marches Into SMTA International with Backup Plans, Big Partnerships, and Bigger X-rays
10/06/2025 | DatestDatest, the industry’s favorite second set of eyes (and hands, and solder joints), is heading to SMTA International 2025 at the Donald E. Stephens Convention Center in Rosemont, IL. Find us at Booth #2627, where high-reliability, high-complexity builds meet their match.
Imec’s New GeSi Modulator Hits 400Gb/s, Paving the Way for Next-Gen Optical Interconnects
10/02/2025 | ImecImec – a world-leading research and innovation hub in nanoelectronics and digital technologies – today announced the successful demonstration of a beyond-110GHz C-band GeSi electro-absorption modulator, fabricated on its 300mm silicon photonics platform.