Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
It’s Only Common Sense: Storytelling That Sells—Stop Pitching, Start Painting Pictures
The Right Approach: Get Ready for ISO 9001 Version 6
GlobalFoundries Partners with A*STAR to Accelerate Advanced Packaging Innovation
May 22, 2025 | GlobalFoundriesEstimated reading time: 2 minutes
GlobalFoundries (GF) announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the Agency for Science, Technology and Research (A*STAR), Singapore’s lead public sector research and development (R&D) agency.
Advanced packaging has become a key R&D priority for the semiconductor industry amid growing demand for artificial intelligence (AI) and other data-intensive applications ranging from high performance data computing and datacenters to 5G / 6G communication and more. To meet these needs, acceleration in advanced packaging technologies will be key to delivering the compact, high-performance and energy-efficient technology solutions needed to drive the industry’s long-term growth.
Under the MOU framework, A*STAR will provide GF with access to its R&D facilities, capabilities and technical support, while GF will provide critical equipment to A*STAR to further its R&D efforts. The collaboration will accelerate GF’s plan to develop and ramp its advanced packaging solutions and expand its offerings to provide customers one-stop solutions for semiconductor chips to be manufactured, processed, packaged and tested at GF’s Singapore manufacturing facility.
“With a robust semiconductor ecosystem and strong R&D support from the government and institutions like A*STAR, Singapore is an ideal location for us to develop and scale our essential innovations at the foundry level,” said Gregg Bartlett, GF’s Chief Technology Officer. “This aligns to our global advanced packaging roadmap and reinforces our commitment to deliver more energy-efficient essential chips that are crucial for our customers, especially in the AI era.”
This collaboration will see skills enhancement initiatives implemented for GF employees, where they can develop new expertise in the area of advanced packaging. It reflects both A*STAR’s and GF’s shared dedication to nurturing the next generation of high technology talent, as well as the continuous upskilling and retraining of talent in tandem with the industry’s evolving needs.
“As Singapore strengthens its position as a critical node in the global semiconductor supply chain, continued R&D collaboration between public research and the industry is essential to drive innovation and maintain our competitive edge. A*STAR looks forward to working closely with GlobalFoundries to accelerate innovation and talent development in advanced packaging technologies and become leaders in this domain,” said Terence Gan, Executive Director at A*STAR Institute of Microelectronics (A*STAR IME).
“Our partnership with A*STAR marks yet another milestone for GF in Singapore, as we continue to play our part in growing local capabilities and talent,” said Tan Yew Kong, Senior Vice President and General Manager of GlobalFoundries Singapore. “With growing demand for AI applications, we’re excited to tap into A*STAR’s expertise and infrastructure to fast-track the deployment of new advanced packaging offerings, and most importantly, upskill our workforce. Our joint efforts in R&D and talent development will ultimately spur the continued growth of Singapore’s semiconductor ecosystem as we work towards Singapore’s Manufacturing 2030 vision.”
The MOU with A*STAR follows an earlier announcement by GF in January this year, where the company announced plans to create a new Advanced Packaging and Photonics Center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. Together, these developments mark significant progress on GF’s strategic roadmap to enhance and scale its advanced packaging offerings in response to customer demand across the regions.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.
Global Interposer Market to Surge Nearly Fivefold by 2034
09/15/2025 | I-Connect007 Editorial TeamRevenue for the global interposer market is projected to climb from $471 million in 2025 to more than $2.3 billion by 2034, according to a new report from Business Research Insights. The growth represents a CAGR of nearly 20 percent over the forecast period.
U.S. CHIPS Act Funding Detailed on SIA Website
09/12/2025 | Nolan Johnson, I-Connect007The U.S. CHIPS Act has moved well into the implementation stage in 2025. But where has that money gone? The Semiconductor Industry Association has been tracking these projects and provides details on its website. It was updated May. Among the five key programs being managed under CHIPS, two stand out as influencing advanced electronic packaging: the National Advanced Packaging Manufacturing Program (NAPMP), and the CHIPS Manufacturing USA Institute (MFG USA).
Advanced Packaging-to-Board-Level Integration: Needs and Challenges
09/15/2025 | Devan Iyer and Matt Kelly, Global Electronics AssociationHPC data center markets now demand components with the highest processing and communication rates (low latencies and high bandwidth, often both simultaneously) and highest capacities with extreme requirements for advanced packaging solutions at both the component level and system level. Insatiable demands have been projected for heterogeneous compute, memory, storage, and data communications. Interconnect has become one of the most important pillars of compute for these systems.
Advanced Packaging: Preparation is Now
09/15/2025 | Nolan Johnson, I-Connect007In this interview, Matt Kelly, CTO for the Global Electronics Association, and Devan Iyer, chief strategist of advanced packaging, define advanced electronics packaging and the critical nature of getting it right in the electronics manufacturing field. They share details from their white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” and provide insight into how next-generation packaging will change the design, fabrication, and assembly of printed circuit boards, including the implications for final system assembly.