Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
NVIDIA Expected to Launch RTX PRO 6000 Special Edition for China’s AI Market, Potentially Boosting Future GDDR7 Demand
May 28, 2025 | TrendForceEstimated reading time: 1 minute
TrendForce reports that following the new U.S. export restrictions announced in April—which require additional permits for the export of NVIDIA’s H20 or any chips with equivalent memory bandwidth or interconnect performance to China—NVIDIA is expected to release a special low-power, downscaled version of the RTX PRO 6000 (formerly B40) for the Chinese market. This model will reportedly switch from the originally planned HBM memory to GDDR7, with a potential market debut as early as the second half of 2025.
TrendForce’s recent industry interviews in China indicate that after the new export rules were introduced, NVIDIA’s Chinese CSP customers have been unable to secure the H20. The previously planned B30 model, which was set to launch in the second half of this year, is now expected to face delays or changes.
TrendForce estimates that the performance of the China-specific RTX PRO 6000 will fall between that of the previous-generation L40S and the L20 China edition. Demand for the L20 remains steady among local CSPs, particularly for applications like small-scale model training or AI inference, suggesting that the RTX PRO 6000 China edition will see a similar uptake upon release. However, as the higher-end H20 and B30 models (equipped with HBM) are blocked from the Chinese market, NVIDIA is poised to face stiffer competition from domestic players like Huawei and Cambricon, who are advancing their own AI solutions.
The memory of the RTX PRO 6000 for the Chinese market will be downgraded from HBM3e to GDDR7 to comply with U.S. export restrictions. Major memory suppliers have begun ramping up GDDR7 production with NVIDIA’s recent launch of the RTX 50 series consumer GPUs. Still, since gaming consoles and other consumer applications have yet to adopt GDDR7, its main demand through the first half of 2026 is expected to come from NVIDIA-led segments—namely PC, workstation GPUs, and AI server applications.
Samsung is set to maintain its lead in GDDR7 production schedules and capacity throughout 2025, commanding a market share as high as 70%. NVIDIA remains heavily reliant on Samsung-manufactured GDDR7. TrendForce expects future GDDR7 price fluctuations to remain relatively stable, with prices either holding steady or seeing slight increases.
Share on:
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
Breakthrough in Non-Contact Solder Removal Earns Kurtz Ersa 2025 Mexico Technology Award at SMTA Guadalajara
09/18/2025 | Kurtz Ersa Inc.Kurtz Ersa Inc., a leading supplier of electronics production equipment, is proud to announce that it has been awarded a 2025 Mexico Technology Award in the category of Rework & Repair for its HR 600P Automatic Rework System.
Knocking Down the Bone Pile: Best Practices for Electronic Component Salvaging
09/17/2025 | Nash Bell -- Column: Knocking Down the Bone PileElectronic component salvaging is the practice of recovering high-value devices from PCBs taken from obsolete or superseded electronic products. These components can be reused in new assemblies, reducing dependence on newly purchased parts that may be costly or subject to long lead times.
On the Line With… Podcast: UHDI and RF Performance
09/17/2025 | I-Connect007I-Connect007 is excited to announce the release of a new episode in its latest On the Line with... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).