-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
High-frequency EMC Noise in DC Circuits
May 29, 2025 | Karen Burnham, EMC UnitedEstimated reading time: 1 minute
EMC isn’t black magic, but it’s easy to understand why it seems that way. When looking at a schematic like that in Figure 1, it looks like you’re only dealing with DC signals all across the board. There’s a 28 VDC input that goes through an EMI filter, then gets converted to 12 VDC power. Except in extremely rare circumstances involving equipment sensitive to magnetostatic fields, DC electricity will never be part of an EMC problem.
Figure 1: Power conversion stage of avionics unit
Harmonics
The biggest problem occurs when you use a switching operation to convert power from one form to another—something most modern electronics do all the time. For power and thermal efficiency reasons, we want switching waveforms to get as close to a perfect square wave as possible—the faster the rise and fall time, the less loss and heating you have in the operation. The problem is that there’s a trade-off: Faster rise and fall times necessarily generate high-frequency electrical signals. Then, if provisions aren’t made for controlling the high-frequency noise signals, they can escape to cause signal integrity and EMC problems throughout the board and system.
Let’s illustrate this with a simple function generator. The beginning setting is a 5 VDC square wave switching at 20 MHz—something you might see from a board’s clock signal. In Figure 2, we see a cable connected to the function generator channel 1 output. That’s the default cable that came with the function generator, with current being run through a 50 Ω resistor between the red and black leads.
To read the entire article, which originally appeared in the May 2025 issue of Design007 Magazine, click here.
Suggested Items
IBM Power11 Raises the Bar for Enterprise IT
07/10/2025 | IBMIBM revealed IBM Power11, the next generation of IBM® Power® servers. Redesigned with innovations across its processor, hardware architecture, and virtualization software stack, Power11 is designed to deliver the availability, resiliency, performance, and scalability enterprises demand, for seamless hybrid deployment on-premises or in IBM Cloud.
Infineon Advances on 300-millimeter GaN Manufacturing Roadmap as Leading Integrated Device Manufacturer (IDM)
07/10/2025 | InfineonAs the demand for gallium nitride (GaN) semiconductors continues to grow, Infineon Technologies AG is poised to capitalize on this trend and solidify its position as a leading Integrated Device Manufacturer (IDM) in the GaN market.
Maxar Awarded Contract by NGA to Deliver Ai-Powered Object Detection Services
07/01/2025 | MaxarMaxar Intelligence, the leading provider of secure, precise geospatial insights, announced that it was awarded Delivery Order 01 under the Luno A program by the National Geospatial-Intelligence Agency (NGA).
Empower Appoints Steve Hertog as Senior Vice President of Sales to Strengthen Next Phase of High Growth
07/01/2025 | Empower SemiconductorEmpower Semiconductor, the world leader in integrated voltage regulators (IVRs), announced the appointment of Steve Hertog as Senior Vice President of Sales. In this role,
OKI, NTT Innovative Devices Establish Mass Production Technology for High-Power Terahertz Devices by Heterogeneous Material Bonding
06/21/2025 | BUSINESS WIREOKI, in collaboration with NTT Innovative Devices Corporation, has established mass production technology for high-power terahertz devices using crystal film bonding (CFB) technology for heterogeneous material bonding to bond indium phosphide (InP)-based uni-traveling carrier photodiodes (UTC-PD) onto silicon carbide (SiC) with excellent heat dissipation characteristics for improved bonding yields.