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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Micron Unveils U.S. Research Lab for Memory and AI Innovation

08/20/2026 | Globe Newswire
Micron Technology, Inc. unveiled Micron Research Labs, a U.S.-based long-horizon premier research institution headquartered in Boise and backed by a planned $10 billion investment over the next decade.

Micron Ventures Launches $250 Million Fund to Invest in the Next Generation of AI

08/14/2026 | Micron
Micron Technology, Inc. launched the Micron Ventures Paradigm Fund, a $250 million investment vehicle built to partner with the companies shaping the future of AI.

Siemens, ASU Launch PCB Design Microcredential

07/29/2026 | Siemens Digital Industries
Siemens, in collaboration with Arizona State University (ASU) has announced a new online microcredential program in printed circuit board (PCB) design - ‘PCB Design Fundamentals: From Discovery to Production’ - offering learners a direct path to an in-demand skillset in the electronics industry.

Abracon Announces Distribution Partnership with WT Microelectronics

07/29/2026 | PRNewswire
Abracon, a leading global manufacturer of frequency control, timing, power, magnetics, RF, antenna, and connectivity solutions, announced a new franchised distribution agreement with WT Microelectronics, a leading global electronic components distributor.

Micross to Acquire AEMtec, Expanding European Advanced Packaging

07/29/2026 | PRNewswire
Micross Components, Inc., a leading provider of high-reliability microelectronic product and service solutions for aerospace, defense, space, medical and industrial applications and a portfolio company of Behrman Capital, announced that it has entered into a definitive agreement to acquire AEMtec GmbH (AEMtec).
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