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Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.

Siemens Expands OSAT Alliance Membership to Build Domestic Semiconductor Supply Chains

05/29/2025 | Siemens
Siemens Digital Industries Software announced the latest members to join its OSAT Alliance program which enables outsourced semiconductor assembly and test (OSAT) providers to develop, validate and support integrated circuit (IC) package assembly design kits (ADKs) that drive broader adoption of emerging technologies by fabless semiconductor and systems companies and help to build secure domestic semiconductor supply chains.

JBD Sets a New Benchmark for MicroLED Micro-Display Technology

05/29/2025 | PRNewswire
At this pivotal juncture when near-eye display technologies are rapidly advancing toward large-scale deployment, JBD, through sustained technological innovation, has succeeded in reducing the number of defective pixels in its MicroLED micro-displays from ≤100 to ≤3 per panel.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.

American Made Advocacy: Lobbying Congress Supports the Supply Chain

05/27/2025 | Shane Whiteside -- Column: American Made Advocacy
The upheaval in world markets is driving daily headlines. The global supply chain has seemed “normal” for the microelectronics industry because over the past three decades, an increasing percentage of microelectronics components and materials have been made overseas. For many years, other countries, primarily in Asia, invested heavily in their microelectronics industry while U.S. companies offshored manufacturing services in pursuit of the lowest cost.
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