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Advanced Electronics Packaging at APEX EXPO with Matt Kelly

04/20/2026 | Real Time with... APEX EXPO
The first advanced electronics packaging conference was well received this year with an engaged audience. Matt Kelly, CTO of the Global Electronics Association says the expanded focus on component and system-level integration fosters unprecedented collaboration across the industry. Also new this year is the Design Pavilion and Technology Theater, bringing commercial value to technical discussions and highlighting the critical role of timely standards development in rapidly evolving sectors like AI and automotive.

Volatile Metals Market Creates PCB Pricing Headache

04/20/2026 | Nolan Johnson, I-Connect007
Market volatility for precious metals is very real. Financial organizations have reported elevated volatility, with record highs and steep corrections; in 2025 alone, gold has increased by over 60%, silver over 120%, and copper over 35%. Each is a critical raw material used in electronics manufacturing, where pricing is already fraught for business owners and their customers due to tariff uncertainty and a critical supply chain that resides mostly in China. The volatility of precious metals markets adds yet another layer of complexity for manufacturers, pushing up raw material costs.

AGC's Advanced PCB Material Solutions

04/17/2026 | Real Time with... APEX EXPO
AGC's line includes advanced PCB materials for critical industries such as aerospace, defense, and medical. This interview highlights their commitment to North American sourcing, offering solutions to today's challenges. AGC provides specialized automotive PCB materials including fastRise, a low-loss non-reinforced prepreg designed for high-frequency applications like 77 GHz radar.

Indium Faces Complex Soldering Head On

04/17/2026 | Real Time with... APEX EXPO
Kevin Brennan of Indium Corporation discusses the complexities of soldering diverse component sizes on high-performance computing boards. He introduces DuraFuse LT solder paste, a novel solution designed to address challenges like uneven heating and warpage during reflow. This innovative alloy enables a wider operational window, reducing peak temperatures and enhancing product reliability without requiring board redesign.

Driving Precision: All4-PCB’s Push for Smarter Inspection and Better Boards

04/17/2026 | Real Time with... APEX EXPO
At APEX EXPO 2026, all4-PCB's booth stayed busy until the very end. In this interview, Managing Director Ralph Jacobo highlights what he sees as strong market momentum in North America driven by increased demand for advanced PCB manufacturing technologies. He emphasizes investments in multilayer lamination, propelled by AI infrastructure, aerospace, and HDI complexity, where precision and uniformity are critical.
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