Global PCB Connections: Rigid-flex and Flexible PCBs—The Backbone of Modern Electronics
Flexible Thinking: The Key to a Successful Flex Circuit Design Transfer
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Top Investment Certification on 2nd Anniversary Boosts ESCATEC’s European Presence
June 9, 2025 | ESCATECEstimated reading time: 1 minute
Two significant milestones in recent days by ESCATEC’s business unit in Bulgaria adds much momentum to the EMS provider’s strategy to nearshore cost-effective and high-quality electronics assembly and plastic moulding services for its customers in the European Union.
ESCATEC Bulgaria (EBG), the Group’s ninth production facility, celebrated its 2nd anniversary in early June with its value proposition generating rapid growth in both capabilities and clientele. The occasion became more memorable by news that the Bulgarian government had awarded its prestigious Investment Class A certification to the company.
EBG’s Investment Class A status followed a comprehensive evaluation process by Bulgaria’s Ministry of Economy and Industry, and acknowledges the company’s compliance with stringent investment and employment criteria. It confers significant benefits to EBG, including expedited administrative procedures, personalised government support, financial incentives for infrastructure development and employee training, and preferential rights to acquire state or municipal property near its operations.
These advantages will facilitate EBG’s goals of expanding production services, onboarding new customers, and growing into ESCATEC’s key hub for electronics assembly and plastic moulding in Europe.
“ESCATEC Bulgaria is a cornerstone of our European strategy. The Class A investment certificate validates our commitment to contribute towards Bulgaria’s economic development and job creation and will further empower us to scale operations in Europe,” said ESCATEC CEO Charles-Alexandre Albin.
ESCATEC choose to locate EBG in Plovdiv (E.U. member Bulgaria’s second-largest city) in view of its large skilled workforce, large industrial base, and efficient transport links that provide convenient access to the wider European market.
The 4000m² facility has a full complement of advanced machinery (including two SMT lines, reflow ovens, AOI and Pick-and-Place stations, high-speed SPI stations, soldering and x-ray machines, laser markers, Kardex vertical carousel storage, testing stations, and four plastic injection moulding machines) for vertical integration of electronics assembly and plastic moulding.
ESCATEC remains committed to expanding its global production footprint and capabilities to cater to customers that are in the process of bringing new technologies and products to market, noted Albin. The Group already offers a full spectrum of EMS services - from design & development to certification to mass manufacturing and after-sales support - across electronics, mechatronics, machining, MOEMS, box build, and plastic moulding.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
American Standard to Participate in European Microwave Week 2025
09/05/2025 | American Standard CircuitsAnaya Vardya, President, and CEO of American Standard Sunstone Circuits has announced that his company will once again be taking part in European Microwave Week, Europe’s premier RF, microwave, radar and wireless event, to be held from September 21-26, 2025 at Jaarbeurs in Utrecht, The Netherlands.
TSMC and South Korean Rivals Lose U.S. Fast-Track Export Privileges for China
09/03/2025 | I-Connect007 Editorial TeamWashington has revoked Taiwan Semiconductor Manufacturing Co.’s (TSMC) special fast-track status for U.S. chip-making equipment exports to its Nanjing, China, plant, Reuters reported on Sept. 2. The move comes days after similar actions against South Korean chip makers Samsung Electronics and SK Hynix.
UHDI Fundamentals: UHDI Technology and Industry 4.0
09/03/2025 | Anaya Vardya, American Standard CircuitsUltra high density interconnect (UHDI) technology is rapidly transforming how smart systems are designed and deployed in the context of Industry 4.0. With its capacity to support highly miniaturized, high-performance, and densely packed electronics, UHDI is a critical enabler of the smart, connected, and automated industrial future. Here, I’ll explore the synergy between UHDI and Industry 4.0 technologies, highlighting applications, benefits, and future directions.
It's Only Common Sense: Leveraging AI in Your Sales Strategy
09/01/2025 | Dan Beaulieu -- Column: It's Only Common SenseLet’s get one thing straight: AI isn’t here to replace you; it’s here to make you smarter and faster. Every time a new tool shows up, half the sales floor panics: “They’re going to automate us out of a job!” This is shouted while doomscrolling LinkedIn. Relax. Sales is still, and will always be, about human connection, trust, and delivering value. However, if you’re not using AI to your advantage, you’re handing your competitors a loaded gun and asking them to shoot first.
I-Connect007 Editor's Choice: Five Must-Reads for the Week
08/22/2025 | Andy Shaughnessy, I-Connect007In this week’s roundup, we have a variety of articles covering design, manufacturing, sustainability, and, of course, tariff negotiations. We have a milestone anniversary to celebrate as well, with Dan Beaulieu about to publish his 1,000th column. When does Dan even sleep? Here’s to hoping that we have 1,000 more weeks of "It’s Only Common Sense."