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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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ACCM Joins Polar’s Speedstack Material Partner Program
June 10, 2025 | Polar InstrumentsEstimated reading time: Less than a minute
Advance Chip & Circuit materials has recently joined the Polar Speedstack Material Partner Program to ease the inclusion of ACCM's innovative Celeritas build up materials into the PCB supply chain.
“Availability of Celeritas in Speedstack eases the specification of ACCM materials for the OEM design community. PCB Technologists often mandate specific materials for demanding high-speed and high-density applications,” said Michael Gay, VP of marketing at ACCM.
This partnership:
- Allows simplified production of build-up technologies with Celeritas
- Provides an on-line and on premise material library from ACCM in Speedstack
- Opens new opportunities to extend the use of UHDI
Speedstack is in widespread use with OEMs who specify PCB stackups for specific applications, and eases the communication of stackup information throughout the PCB supply chain as PCB fabricators across the world are familiar with Speedstack’s clear and concise documentation and the availability of stackup data in XML format which can be imported into multiple production systems at the time of fabrication.
Suggested Items
Symposium Review: Qnity, DuPont, and Insulectro Forge Ahead with Advanced Materials
07/02/2025 | Barb Hockaday, I-Connect007In a dynamic and informative Innovation Symposium hosted live and on Zoom on June 25, 2025, representatives from Qnity (formerly DuPont Electronics), DuPont, and Insulectro discussed the evolving landscape of flexible circuit materials. From strategic corporate changes to cutting-edge polymer films, the session offered deep insight into design challenges, reliability, and next-gen solutions shaping the electronics industry.
Target Condition: Are Autorouters Friend or Foe?
07/01/2025 | Kelly Dack -- Column: Target ConditionFor PCB designers, just hearing the word “autorouters” can trigger everything from eye rolls to heated debate. We all have stories—some painful, some comical—of boards gone sideways at the hands of an overzealous routing algorithm. But these tools aren’t going away, and frankly, they shouldn’t. Used wisely, they can save some project teams hours or even days. Used blindly, they can cost weeks. So, where do autorouting tools stand today, and is interactive routing the smarter path forward?
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
EU Defence Electronics Ecosystem Highlighted in Brussels
07/01/2025 | I-Connect007 Editorial TeamIn this interview, Alison James, senior director of Global Electronics Association—Europe (formerly IPC), discusses the European Defence & Security Summit in Brussels, June 9–13, as well as the first IPC–ASD Europe Defense Electronics Summit, June 10th, which brought together 70 leaders from across the electronics manufacturing supply chain. ASD is the Aerospace, Security and Defence Industries Association of Europe, and co-hosted both the larger and smaller events.