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Companion Guide to Popular UHDI Podcast Series Now Available for Download

03/12/2026 | I-Connect007
The companion guide to On the Line With…American Standard Circuits: Ultra High Density Interconnect (UHDI) explores how UHDI is reshaping PCB design and manufacturing. As trace widths shrink from 25 microns toward 5 microns, UHDI enables finer geometries, tighter impedance control, improved RF performance, and reduced layer counts.

Micron Celebrates Opening of India’s First Semiconductor Assembly and Test Facility

03/02/2026 | Globe Newswire
Micron Technology, Inc. celebrated the grand opening of its semiconductor assembly and test facility in Sanand, Gujarat, India.

Lam Research Expands Boise Investment to Support U.S. Chip Growth

02/18/2026 | PRNewswire
In a ribbon-cutting ceremony, Lam Research Corp. commemorated the opening of its new office in Boise, Idaho, joined by U.S. Senator Jim Risch, representatives of Micron Technology, Inc. and other distinguished local government, community, and academic leaders.

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

Micron Breaks Ground on Advanced Wafer Fabrication Facility in Singapore

01/27/2026 | Micron
Micron Technology, Inc. broke ground on an advanced wafer fabrication facility located within the company's existing NAND manufacturing complex in Singapore.
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