SEMI FlexTech Solicits Proposals for Advancing the Future of Flexible Hybrid Electronics

Estimated reading time: 1 minute

FlexTech, a SEMI Technology Community, today issued a Request for Proposals (RFP) to advance flexible hybrid electronics (FHE) technologies, including the development of advanced materials and additive processing. Selected projects will receive cash awards ranging from $250,000 to $750,000. The program is funded by the Army Research Laboratory (ARL). ARL funding will be matched with contributions by selected recipients to cover total project cost.

The RFP seeks proposals targeting FHE advances in the following areas:

A. Advanced Materials2b330685bda54295a098181db2b43578.png
B. Integrated Digital Twin Platforms for Multiscale, Multimaterial, Additive Electronics Manufacturing
C. System Integration, Reliability, and Standards for Scalable FHE and Additive Electronics Manufacturing
D. Restricted Open Topics

• Market & Application Landscape Assessment
• Process Development Kit for FHE
• 3D Geometry & Co-Design Tools 

Organizations submitting proposals will be evaluated based on their capabilities, experiences, and strengths. See the FlexTech 2025 RFP for more details on the evaluation process.

White Paper Submissions

White paper submissions, the first step in responding to the RFP, are due July 14, 2025. Following the review of white papers by the RFP review committee, FlexTech will invite selected organizations to submit full proposals. The committee consists of FlexTech Council members and other subject matter experts (SMEs). Evaluation criteria include:

• Rationale
• Budget
• Collaboration value
• Dual-use (industry and military) applicability
• Relevance to the FHE ecosystem
• Schedules and milestones
• Reasonable and stretch deliverables
• Overall proposal quality