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Specially Developed for Laser Plastic Welding from LPKF
June 25, 2025 | LPKFEstimated reading time: 1 minute

LPKF introduces TherMoPro, a thermographic analysis system specifically developed for laser plastic welding that transforms thermal data into concrete actionable insights. Through automated capture, evaluation, and interpretation of surface temperature patterns immediately after welding, the system provides unprecedented process transparency that correlates with product joining quality and long-term product stability. TherMoPro data enables welding process optimization to enhance component strength and long-term stability in a new dimension – completely non-destructively.
The system is designed for easy integration into existing production lines as a retrofit solution or as part of any new installation from the LPKF laser plastic welding product portfolio. Since thermographic analysis takes place directly after the welding process, usually cycle-time neutral, TherMoPro saves valuable space and time. Depending on the process, this inline approach can replace conventional quality control stations or reduce testing intervals for cost-intensive additional inspections, thus keeping production flow efficient – including full process transparency and traceability to every product ID.
"TherMoPro is far more than a standard thermal camera," explains Thomas Sontheimer, Senior Project Leader WeldingEquipment at LPKF. "Our solution approach offers real added value through the perfect synergy between specialized data acquisition and application-oriented analysis."
Developed in collaboration with experts specifically from the field of Automatic Optical Inspection (AOI), the system converts complex thermal data into more than 20 different quality parameters. This comprehensive analysis enables users to:
• Identify components that pass initial leak tests but would fail during temperature cycling tests
• Optimize processes for improved strength and reduced cycle times
• Monitor material property or process variations in real-time
• Achieve secure traceability with thermal data linked to each component ID
Benefits for markets with high quality requirements
For medical device manufacturers, the TherMoPro system provides the foundation for regulatory compliance, essential documentation requirements, and traceability while ensuring the long-term integrity of, for example, fluid-carrying components and sensitive enclosures. The ability to detect subtle thermal anomalies is particularly important for components with zero-defect tolerance.
Automotive suppliers benefit from TherMoPro's ability to monitor production variations in multi-cavity tools, ensuring consistent quality in high-volume production. As the industry increasingly incorporates recycled materials and flame retardants into plastic components, the system's ability to detect and compensate for varying material properties becomes crucial for maintaining quality standards while meeting sustainability goals.
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Julia McCaffrey - NCAB GroupSuggested Items
Sustainability and Selective Soldering
09/15/2025 | Dr. Samuel J. McMaster, Pillarhouse InternationalSustainability is more than just a buzzword for the electronics industry; it’s a key goal for all manufacturing processes. This is more than a box-ticking exercise or simply doing a small part for environmentally friendly processes. Moving toward sustainable solutions drives innovation and operational efficiency.
Trouble in Your Tank: Implementing Direct Metallization in Advanced Substrate Packaging
09/15/2025 | Michael Carano -- Column: Trouble in Your TankDirect metallization systems based on conductive graphite are gaining popularity throughout the world. The environmental and productivity gains achievable with this process are outstanding. Direct metallization reduces the costs of compliance, waste treatment, and legal issues related to chemical exposure. A graphite-based direct plate system has been devised to address these needs.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
Integrating Uniplate PLBCu6 With the Digital Factory Suite
09/12/2025 | Giovanni Obino and Andreas Schatz, MKS' AtotechPrinted circuit board manufacturing is rapidly changing, driven by miniaturization, stringent reliability requirements, and growing pressure for sustainable production. Meeting these challenges requires more than incremental improvements; it demands a combination of precise equipment and real-time process intelligence. The pairing of Uniplate® PLBCu6 with the Digital Factory Suite (DFS) demonstrates how hardware and software can work together to create more responsive, resource-efficient manufacturing.
Closing the Loop on PCB Etching Waste
09/09/2025 | Shawn Stone, IECAs the PCB industry continues its push toward greener, more cost-efficient operations, Sigma Engineering’s Mecer System offers a comprehensive solution to two of the industry’s most persistent pain points: etchant consumption and rinse water waste. Designed as a modular, fully automated platform, the Mecer System regenerates spent copper etchants—both alkaline and acidic—and simultaneously recycles rinse water, transforming a traditionally linear chemical process into a closed-loop system.