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This week, U.S. budget proposals, potential tax and spending cuts, and a huge potential increase to the U.S. deficit have dominated U.S. news, as well as the Federal Reserve chairman hinting that they might consider a small decrease in the interest rate in the coming months. European headlines have continued to be dominated by global trade challenges and strategy, as well as the historic heat waves affecting many parts of the country, sparking more discussion around climate change. Hong Kong’s stock market saw a nice surge this week, even as the greater China economy struggles, amidst hope that news of a trade agreement being reached between China and the U.S. will help stabilize things a bit.
For our industry, we have seen several bullish market announcements over the past few weeks, including one this week by IDC on the massive growth in the global server market. We’re also closely watching global trade and nearshoring.
One good example of successful nearshoring is Rehm Thermal Systems, which celebrates its 10th anniversary in Mexico and the official opening of its new building in Guadalajara. The machinations of geopolitics and geoeconomics was on full display in Europe in June, so check out our interview with Alison James about the focus on defense electronics by the Global Electronics Association.
For designers, I highlight NCAB’s Ryan Miller’s latest column on designing for teeny tiny components and the challenges therein. Finally, I round out my top pics this week with Simon Khesin’s latest article on direct imaging, which kicks off with a fun techie throwback comparison—something I always appreciate.
Worldwide Server Market Value Will Reach 366 billion in 2025, Representing a 45% Growth Compared to 2024
Published June 30
If you were skeptical about projected growth numbers for the data server market being pushed ever upward by AI, don’t be. It’s real. International Data Corporation (IDC) Worldwide Quarterly Server Tracker recently announced updated numbers, and while staggering, are not surprising. With 134.1% growth in 2025 Q1 over 2024, the U.S. is still the fastest-growing server market in the world, with China as number two. If you follow the markets (and who doesn’t), this is a quick must-read.
EU Defence Electronics Ecosystem Highlighted in Brussels
Published July 2
As the European Union grapples with its defense needs and the lack of adequate domestic manufacturing capacity to fulfill them, the Global Electronics Association (formerly IPC) in Europe held the IPC–ASD Europe Defense Electronics Summit on June 10 during the same week that the European Defence & Security Summit took place in Brussels. In this I-Connect007 interview, Alison James, senior director of Global Electronics Association—Europe, discusses the purpose of having this summit at this time, and underscores the critical role that European defense has come to occupy since the Russia-Ukraine war, and all of the lessons it has yielded.
Rehm Open House Celebrates 10 Years In Mexico
Published June 30
Luis Garcia of Rehm Thermal Systems, in celebrating the 10th anniversary of their Mexico facility in Guadalajara, recounts how starting a facility in Mexico 10 years ago was a challenging endeavor. With all they’ve accomplished since then, Rehm is positioned well in the era of nearshoring and global trade challenges. Projecting good growth despite global trade barriers, Mr. Rehm visited the Guadalajara plant just this week for a big celebration in Mexico. Luis says all customers are welcome.
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Published June 30
This column by Ryan Miller, with assistance from John Piccirilli, goes into some detail as to how designers may be grappling with insanely small components and packaging requirements. “Micro components have redefined what is possible in PCB design, Ryan writes. “With package sizes like 01005 and 0201 becoming more common in high-density layouts, designers are now expected to pack more performance into smaller spaces than ever before.” It’s a topic of conversation that never seems to get old, as we all forge through some of these challenges together. This is a must-read for PCB designers.
Driving Innovation: Direct Imaging vs. Conventional Exposure
Published July 2
I knew I would enjoy Simon Khesin’s latest column when I read the first sentence, “My first camera used Kodak film.” In comparing transformations in imaging in the printed circuit board industry to those of the camera from the 1980s to today, Simon highlights the “higher accuracy” and “better results” a manufacturer can achieve using direct imaging technology and the elimination of phototools.
