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PEDC Call for Abstracts Deadline Extended to Aug. 31

08/20/2025 | I-Connect007 Editorial Team
The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31. Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.

Haylo Labs Acquires Plessey Semiconductors

08/20/2025 | Haylo Labs
Haylo Labs has acquired Plessey Semiconductors, the UK’s leading innovator in microLED display technology.

Polar Instruments Announces Additive Transmission Line Support for Si9000e

08/20/2025 | Polar Instruments
Transmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures.

Meet the Round 1 Winners of the Bright Manufacturing Student Challenge 2025

08/20/2025 | Tara Dunn, SMTA
The Bright Manufacturing Student Challenge is an opportunity for student teams to design and develop innovative solutions for real-world electronics manufacturing problems. The eight-week competition, sponsored by the Electronics Manufacturing & Assembly Collaborative (EMAC) through electronicsworkforce.com, allows students to showcase their technical skills, creativity, and problem-solving abilities.

SoftBank Group and Intel Corporation Sign $2B Investment Agreement

08/19/2025 | Intel Corporation
SoftBank Group Corp. and Intel Corporation today announced their signing of a definitive securities purchase agreement, under which SoftBank will make a $2 billion investment in Intel common stock.
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