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BAE Systems Receives $12 Million Contract from L3Harris
July 25, 2025 | BAE SystemsEstimated reading time: 1 minute
BAE Systems has received a $12 million contract from L3Harris to support the modification of two Gulfstream G550 aircraft into airborne electronic attack (EA) platforms for the Italian Air Force. When the airframes are fitted with modern EA mission systems, they will provide Italy with powerful, long-range capabilities that disrupt and suppress enemies’ command and control, communication, navigation, and air defense systems.
Under its contract, BAE Systems will provide hardware to modify the aircraft, including racks, radomes, cables, and harnesses to prepare for the installation of advanced electronic warfare mission systems that will enhance Italy’s ability to operate in the electromagnetic battlespace.
“This modification work is a critical step toward delivering advanced EA capabilities to the Italian Air Force,” said Cory Casalegno, director for Coalition Electronic Attack at BAE Systems. “Providing high-powered, long-range jamming capabilities to an important U.S. ally broadens the strength of the global allied fleet and supports the mission of the U.S. Air Force.”
BAE Systems’ airborne EA mission systems complement the range, altitude, and endurance attributes of the G550 business jets, providing long-range jamming from safer operational distances. The systems limit adversaries' situational awareness, disrupt their use of the electromagnetic spectrum for operations, and align with the capabilities of the U.S. Air Force.
BAE Systems has designed and developed advanced EA mission systems for decades, continually evolving the technology to address modern threats, and redesigning hardware for different airframes – carefully balancing the need for high-power output with size, weight, and power constraints.
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Brent Fischthal - Koh YoungSuggested Items
TTCI and The Training Connection Strengthen Electronics Manufacturing with Test Services and Training at PCB West 2025
09/16/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a trusted provider of electronic test and manufacturing solutions, and The Training Connection LLC (TTC-LLC) will exhibit at PCB West 2025, taking place Wednesday, October 1, 2025, at the Santa Clara Convention Center in California. Visitors are invited to Booth 113 to explore the companies’ complementary expertise in test engineering services and workforce development for the electronics industry.
TTM Technologies to Exhibit at the Electronica India 2025 Exhibition in Bengaluru, India
09/16/2025 | Globe NewswireTTM Technologies, Inc., a leading global manufacturer of technology solutions, including mission systems, radio frequency (RF) components, RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCBs), will exhibit at the Electronica India 2025 trade fair, at Hall 3, booth #H41, from September 17-19, 2025, at the Bangalore International Exhibition Centre, Bengaluru, India.
Beyond the Board: What Companies Need to Know Before Entering the MilAero PCB Market
09/16/2025 | Jesse Vaughan -- Column: Beyond the BoardThe MilAero electronics supply chain offers opportunities for manufacturers that are both prestigious and strategically important. Serving prime contractors and Tier-1 suppliers can mean long-term program stability and the satisfaction of contributing to national security. At the same time, this sector is unlike commercial electronics in almost every respect. Success requires more than technical capabilities, it requires patience, preparation, attention to detail, and a clear understanding of how the business model differs.
India’s Aerospace and Defence Engineered for Power, Driven by Electronics
09/16/2025 | Gaurab Majumdar, Global Electronics AssociationWith a defence budget of $82.05 billion (2025–26) and a massive $223 billion earmarked for aerospace and defence spending over the next decade, India is rapidly positioning itself as a major player in the global defence and aerospace market.
I-Connect007 Launches Advanced Electronics Packaging Digest
09/15/2025 | I-Connect007I-Connect007 is pleased to announce the launch of Advanced Electronics Packaging Digest (AEPD), a new monthly digital newsletter dedicated to one of the most critical and rapidly evolving areas of electronics manufacturing: advanced packaging at the interconnect level.