Napino Tech Ventures, Teksun Launch Rapidise with $4M Seed Funding to Accelerate AIoT Product Innovation and Electronics Manufacturing

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Napino Tech Ventures Pvt. Ltd. (NTV) and Teksun Microsys Pvt. Ltd. have launched Rapidise Technology Pvt. Ltd. (RTPL) with $4 million in seed funding, aimed at transforming how AI-enabled connected devices are designed, engineered, and manufactured at scale.

Rapidise serves as a one-stop Original Design Manufacturer (ODM) for startups, SMBs, and enterprises developing next-generation, AI-powered products. As an ODM, Rapidise not only manufactures but also designs, prototypes, certifies, and manages the full product lifecycle, enabling customers to focus on branding and market strategy while Rapidise delivers turnkey innovation.

"Rapidise unites best-in-class product engineering with scalable manufacturing to accelerate AIoT innovation," said Vaibhav Raheja, Board of Director at Rapidise and Jt.MD at Napino Auto.

Strategic Vertical Integration for Scale

Rapidise integrates product design and engineering expertise from Teksun with Napino group's advanced electronics manufacturing infrastructure in India. This vertical integration supports rapid innovation and high-volume production for sectors such as automotive, healthcare, industrial, and consumer electronics.

The company has already delivered over one million smart IoT devices and holds $81M+ in booked orders across North America, Europe, the Middle East, and APAC.

"Our vision is to be a world-leading ODM player, recognized for innovation, agility, and commitment to empowering intelligent, high-performance solutions," said Brijesh Kamani, Founder and CEO of Rapidise. "By combining engineering and manufacturing under one roof, we're ready to power the next generation of AI-enabled IoT products."

Global Manufacturing Excellence

Headquartered in India, Rapidise operates fully automated, Japanese SMT lines (Class 7 Clean Room), Camera Module Manufacturing (Class 6 Clean Room), AI-powered PCB assembly lines, mechanical tooling, and full box-build assembly infrastructure. This enables the production of complex electronics, including:

• IoT modules and gateways
• Camera modules, dash cameras, and body-worn cameras
• 5G-enabled surveillance systems and automotive edge AI devices
• Infotainment devices, smart TVs, and mobile phones
• Smart Devices for Agri-tech, Fin-tech, Utilities and Industry 4.0 Applications