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Statement from the Global Electronics Association on the July 2025 Tariff on Copper Foil and Electronics-Grade Copper Inputs

07/31/2025 | Global Electronics Association
We are disappointed by today’s decision to impose a 50% tariff on imported copper foil and other essential materials critical to electronics manufacturing in the United States.

Clear Demand Signal Needed for CHIPS Success

08/01/2025 | I-Connect007 Editorial Team
In July, the National Defense Industrial Association’s (NDIA) Electronics Division released a white paper titled Clear Demand Signal Needed for CHIPS Success. The paper highlights the importance of the CHIPS and Science Act’s $52 billion investment in revitalizing secure domestic semiconductor production, but also raises the alarm that the Act mainly addresses supply challenges and has not established mechanisms to ensure ongoing demand for U.S.-based microelectronics production.

Considering the Future of Impending Copper Tariffs

07/30/2025 | I-Connect007 Editorial Team
The Global Electronics Association is alerting industry members that a potential 50% tariff on copper could hit U.S. electronics manufacturers where it hurts.

Target Condition: The 5 Ws of PCB Design Constraints

07/29/2025 | Kelly Dack -- Column: Target Condition
Have you ever sat down to define PCB design constraints and found yourself staring at a settings window with more checkboxes than a tax form? You’re not alone. For many designers—especially those newer to the layout world—the task of setting up design constraints can feel like trying to write a novel in a language you just started learning.

Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4

07/16/2025 | Nash Bell -- Column: Knocking Down the Bone Pile
In 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
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