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MACOM Completes Transfer of RTP Wafer Fab
August 5, 2025 | MACOMEstimated reading time: Less than a minute
MACOM Technology Solutions Holdings, Inc., a leading supplier of semiconductor products, announced it has assumed full operational control of the wafer fabrication facility it purchased, located in Research Triangle Park, North Carolina.
This semiconductor wafer manufacturing facility produces highly specialized GaN-on-SiC process technologies for use in RF power devices and monolithic microwave integrated circuits (MMICs). Products manufactured at this site are typically used in telecommunication system infrastructure and defense electronics. The facility is an accredited United States Department of Defense Trusted Foundry.
“This transfer is occurring approximately six months ahead of schedule,” said Stephen G. Daly, MACOM’s President and Chief Executive Officer. “Our leadership and management team are focused on opportunities to improve the fab’s performance and key operational metrics. The best results are yet to come.”
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Brent Fischthal - Koh YoungSuggested Items
ASMPT Introduces MEGA Multi-chip Bonding Platform
08/06/2025 | ASMPTASMPT SEMI, a leading provider of forward-looking solutions for advanced packaging and semiconductor assembly, sets the standard in precision and speed with its new MEGA multi-chip bonding platform.
onsemi Reports Second Quarter 2025 Results
08/05/2025 | onsemionsemi announced its second quarter 2025 results with revenue of $1,468.7 million.
Global Semiconductor Sales Increase 7.8% from Q1 to Q2; Month-to-Month Sales Tick Up 1.5% in June
08/05/2025 | SIAThe Semiconductor Industry Association (SIA) announced global semiconductor sales were $179.7 billion during the second quarter of 2025, an increase of 7.8% compared to Q1.
iDEAL Signs Technology Partner Agreement for SuperQ MOSFETs with Power System Specialist Richardson Electronics, Ltd.
08/01/2025 | PR NewswireiDEAL Semiconductor, a fabless power semiconductor company focused on delivering breakthrough efficiencies, has announced it will partner with Power and RF specialist, Richardson Electronics.
LQDX Inc. Completes Sale of Aluminum Clad Laminate IP to Toyo Aluminium K.K.
07/31/2025 | PR NewswireLQDX, formerly known as Averatek Corp., developer of high-performance materials for advanced semiconductor manufacturing, today announced that it has completed the divestiture of its Aluminum Clad Laminate IP – known as ACL™ – to Toyo Aluminium K.K., a Japan-based global market leader in specialty aluminum-based products for the consumer, electronics and automotive sectors.