Predictive Battery Management Technology from TI Delivers Up to 30% Longer Run Time in Battery-Powered Electronics
August 5, 2025 | Texas InstrumentsEstimated reading time: 1 minute
Texas Instruments (TI) introduced new single-chip battery fuel gauges with first-of-its-kind adaptive Dynamic Z-Track™ technology for more efficient, reliable operation in battery-powered devices. Compared to traditional gauging methods, the predictive modeling algorithm in TI’s BQ41Z90 and BQ41Z50 gauges achieve industry-leading state-of-charge and state-of-health accuracy within 1% error, helping extend battery run time by up to 30%.
As users demand more power from electronics, such as laptops, e-bikes and portable medical devices, battery management systems (BMSs) must provide precise, accurate, real-time monitoring. The BQ41Z90 and BQ41Z50 fuel gauges with Dynamic Z-Track technology help engineers design electronic devices with accurate battery capacity readings, even under unpredictable loads. With this increased accuracy, engineers can select a battery size with confidence, eliminating the need for oversized batteries.
“Whether you’re finishing a project on your laptop or riding home on an e-bike, accurate battery capacity estimates and reliability are critical,” said Yevgen Barsukov, Ph.D., TI Fellow and head of BMS algorithm development. “Traditional battery monitoring methods often struggle with accuracy under erratic use conditions, leading to unreliable predictions. However, our new Dynamic Z-Track technology is a predictive battery model that can self-update across dynamic load conditions, like those created by AI applications, ensuring the most accurate run-time prediction. Evolving from 20 years of reactive monitoring, this innovation enables users to experience dependable function, safer operation, and precise tracking of battery age and run time.”
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
indie’s Narrow-Linewidth Visible Lasers Drive Quantum and Automotive Innovation
10/14/2025 | indie Semiconductorindie, an automotive solutions innovator, has released a new Visible Distributed Feedback (DFB) gallium nitride-based (GaN) laser diode from its Photonics BU product line, enabling next-generation quantum, a wide range of automotive applications, including LiDAR and sensing, and Industrial Raman applications with ultra-stable, sub-MHz linewidths at wavelengths from the near-UV (375 nm) to green (535 nm).
Gentex Expands Partnership with Anduril to Deliver the AI-Driven EagleEye System for the Modern Warfighter
10/14/2025 | BUSINESS WIREGentex Corporation, a global leader in integrated helmet systems and communications solutions, is proud to announce the advancement of its partnership with Anduril Industries in the development of EagleEye.
Wiley Launches Interoperable Platform to Power Scientific Discovery in World's Leading AI Technologies
10/14/2025 | BUSINESS WIREWiley, a global leader in authoritative content and research intelligence, announced the launch of Wiley AI Gateway, the industry's first AI-native research intelligence platform that provides researchers access to trusted content from world-leading scholarly publishers through a single endpoint.
Momentus Signs $15 Million Global Agreement with Solstar Space
10/14/2025 | BUSINESS WIREMomentus Inc., a commercial space firm specializing in satellite solutions and in-space infrastructure, announced a three-year reciprocal services agreement with Solstar Space (Solstar).
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.