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Suggested Items

Getting Our ‘Fil’ of Design Constraint Techniques

08/07/2025 | Andy Shaughnessy, Design007 Magazine
Filbert Arzola is a principal electrical engineer at Raytheon SAS and an instructor who teaches one of the few classes (that I know of) that focuses on setting design constraints. I asked Fil to share his thoughts on design constraints: the factors involved, the various trade-offs, and his best practices for optimizing constraints for your particular design. As Fil says, “Everything about a PCB is a constraint.”

Review: PCEA Orange County Summer Meeting

08/06/2025 | Dan Feinberg, Technology Editor, I-Connect007
The Printed Circuit Engineering Association (PCEA) represents a community of engineers, designers, and industry influencers dedicated to the advancement of PCB technology, design, and manufacturing, and the growth and knowledge of its membership. PCEA regularly hosts events to share the latest developments, best practices, and visions for the future of electronic design and manufacturing. The Orange County chapter seems to be one of the largest and most active ones and I was invited to attend the latest chapter event on July 24 in Costa Mesa, California.

Circuit Check Acquires Solution Sources Programming (SSP) to Become a Full-Service Test and Programming Provider with Expanded Presence in Silicon Valley

08/05/2025 | PR Newswire
Circuit Check, a global leader in turnkey functional test systems across medical, automotive, industrial, military/aerospace, and emerging AI applications, today announced the acquisition of Solution Sources Programming (SSP), a trusted Silicon Valley provider of integrated test and programming solutions for over 35 years.

Advancing Electrolytic Copper Plating for AI-driven Package Substrates

08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ Atotech
The rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.

Dana on Data: Best Practices in Interpreting Drawing Notes—‘Use Latest Revision’

08/07/2025 | Dana Korf -- Column: Dana on Data
The global nature of electronics manufacturing requires clear, consistent, and precise communication, particularly in technical documentation. An area where miscommunication often arises is in interpreting drawing notes—small lines of text with the potential to dramatically impact product quality, manufacturing efficiency, and customer satisfaction.
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