-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
Foxconn Research Institute, National Yang-Ming Chiao Tung University Jointly Create a New Era of Spatial Computing
August 8, 2025 | FoxconnEstimated reading time: 1 minute
The Semiconductor Division of Hon Hai Research Institute (HHRI) , a subsidiary of Hon Hai Technology Group, the world's largest technology manufacturing platform service company, has once again broken through technological boundaries, successfully developing the world's first monolithically integrated metasurface-photonic crystal surface-emitting laser (meta -PCSEL) technology for depth sensing systems, significantly advancing the application of spatial computing.
This technological breakthrough was achieved by Director Guo Haozhong of the Semiconductor Division of Hon Hai Research Institute and Chair Professor at National Yang-Ming National Chiao Tung University, in collaboration with Group Leader Hong Yuheng, Researcher Xu Yezheng, and Researcher Miao Wenqian of the Semiconductor Division, and a research team led by Assistant Professor Huang Yaowei of National Yang-Ming National Chiao Tung University. The related paper, " Monolithically Integrated Metasurface on a PCSEL for Depth Perception ," has been published in the leading global journal Nano Letters * and was selected as the journal's cover story for the July 2025 issue.
Compared to traditional dot projectors, this chip-scale projection technology boasts an ultra-small footprint of 0.025 mm³ , making it the world's smallest projector. Compared to dot projectors used in commercial mobile phones, its volume is approximately 2,450 times smaller, while power consumption is reduced by 28.7% . This single-chip integration technology enables significant system miniaturization and overall power savings, opening up new possibilities for spatial computing in mobile devices, wearables, and augmented reality (AR) applications.
Single-chip integration technology significantly reduces system complexity and energy consumption, providing more competitive solutions for industrial applications. This technological breakthrough not only demonstrates Foxconn's leading position in nano-optics and semiconductor technology, but also lays the foundation for future applications of spatial computing. Looking ahead, this technology will accelerate the popularization of AR , VR , and smart wearable devices.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Synopsys, GlobalFoundries Establish Pilot Program to Bring Chip Design and Manufacturing to University Classrooms
09/05/2025 | GlobalFoundriesSynopsys, Inc. and GlobalFoundries (GF) announced a new collaboration to launch an educational ‘chip design to tapeout’ program for universities worldwide.
SEMI Reports Global Semiconductor Equipment Billings Increased 24% Year-Over-Year in Q2 2025
09/05/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced in its Worldwide Semiconductor Equipment Market Statistics (WWSEMS) Report that global semiconductor equipment billings increased 24% year-over-year to US$33.07 billion in the second quarter of 2025.
LPKF Strengthens LIDE Technology Leadership with New Patent Protection in Korea
09/04/2025 | LPKFLPKF Laser & Electronics SE today announced that its groundbreaking LIDE (Laser Induced Deep Etching) technology has received additional patent protection in Korea through the Korean Patent Office (KPCA), effective September 1, 2025.
Koh Young Showcases Advanced Dimensional Metrology and Inspection Solutions for Semiconductor and Wafer-Level Packaging at SEMICON West
09/03/2025 | Koh YoungKoh Young Technology, the industry leader in True 3D™ measurement-based dimensional metrology and inspection solutions, will present its latest advancements for semiconductor and advanced packaging applications at SEMICON West 2025 in Booth 5949.
ASMPT Joins 'JOINT3' Consortium to Develop Next-Generation Semiconductor Packaging
09/03/2025 | ASMPTASMPT Limited (ASMPT), a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics, announced its participation in the "JOINT3" consortium to develop next-generation semiconductor packaging.