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U.S. Aerospace, Defense Firms Accelerate Digital Strategies

05/13/2026 | BUSINESS WIRE
U.S. aerospace and defense enterprises are adopting integrated digital practices, AI-enabled design and software-centric development approaches as the requirements for competitiveness change, according to a new research report published by Information Services Group (ISG)

Mobix Labs Wins Additional Boeing 737 Aerospace Order

05/12/2026 | BUSINESS WIRE
Mobix Labs, Inc., a provider of advanced connectivity and high-reliability technology solutions for aerospace, defense, and mission-critical applications, announced a new aerospace product order from a returning customer, expanding the deployment of Mobix Labs components inside a next-generation secure onboard aircraft system certified for Boeing 737NG commercial aircraft.

Three Howard University Engineers Launch Trace to Automate PCB Design Workflows

05/12/2026 | Globe Newswire
Trace, an AI software company automating the printed circuit board (PCB) design workflow, has launched out of stealth and is now accepting customers worldwide.

Green Circuits to Discuss Space-Ready Electronics Manufacturing to Space Tech Expo USA

05/12/2026 | Green Circuits
Green Circuits, a full-service electronics manufacturing services (EMS) partner to leading OEMs in aerospace and defense, medical and health technology, industrial electronics, and semiconductor and AI hardware markets, will exhibit at Space Tech Expo USA 2026, taking place June 2–4 in Anaheim.

Knocking Down the Bone Pile: Precision Milling of Underfilled Surface-mount Components

05/13/2026 | Nash Bell -- Column: Knocking Down the Bone Pile
Underfill is a polymeric material used to fill the gap between a printed circuit board and the underside of surface-mount area-array packages such as BGA, QFP, and QFN devices, thereby surrounding and protecting the solder interconnections. This material increases the component's reliability when subjected to mechanical impacts and shocks by distributing forces. 
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