Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

New Meet the Author Episode Explores Direct Metallization in Advanced PCB Manufacturing

10/28/2026 | I-Connect007
I-Connect007 is pleased to announce the release of its latest Meet the Author podcast episode, featuring Carmichael Gugliotti, Line of Business Director for Primary Metallization at MacDermid Alpha Electronics Solutions and author of The Printed Circuit Designer’s Guide to Direct Metallization: A Guide to Complex PCB Fabrication. As PCB designs become increasingly complex, fabricators face growing pressure to deliver higher performance while reducing process complexity, resource consumption, and waste. Direct metallization, a technology with decades of history, is gaining renewed attention as manufacturers seek more efficient and sustainable approaches to PCB production.

Punching Out: How Are the Big Boys Doing Now?

10/26/2026 | Tom Kastner -- Column: Punching Out!
I thought it would be interesting to check in again on what the larger North America-based public companies in the PCB and EMS industry are doing. In general, sales, profits, and stock prices are up, and many are doing smaller, non-core acquisitions. In particular, growth markets include AI infrastructure, defense, and certain areas of healthcare. Here’s a breakdown of some of the largest companies.

ICT 2026 Annual Symposium Review (Part 2): Solving Complex Manufacturing Challenges

10/23/2026 | Pete Starkey, FInstCT
A logical follow-on from the discussion of AI infrastructure was a practical example of AI applications in a PCB manufacturing environment. Oliver Cleveley-Jones and his colleagues Patrick Brown and Sam Hair from Alpha Machines described the development and benefits of an AI-driven integrated digital-twin architecture, and what it looks like from the inside of a working factory. 

SEMICON West 2026: Another Sold Out Show

10/21/2026 | Marcy LaRont, I-Connect007
It was a beautiful Fall Day in the heart of downtown San Francisco, as I headed off to the first official day of SEMICON West 2026 on October 13th. Luckily, the beautiful, sunny and crisp Fall weather would endure throughout the week, just as the state was also seeing unprecedented storm activity, flooding and damaging wave activity on the Southern California coast, that juxtaposition in what had once been the only real tech-forward state in the U.S. not lost on me.

Breaking Down the Barriers Between Design and Manufacturing in France

10/15/2026 | Marcy LaRont, I-Connect007 Magazine
The IPC Designers Council France has nearly doubled since I-Connect007 last reached out to Thomas Romont, a manager at WWEC who leads the council. But growth is only part of the story. Through working groups, practical design tools, and an annual conference, the council is creating opportunities for designers, engineers, fabricators, EMS providers, and other stakeholders to solve problems together. Thomas explains how the group is addressing gaps in design guidance, improving communication between design and manufacturing, and encouraging the kind of collaboration increasingly required across the electronics industry.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in