PEDC Call for Abstracts Deadline Extended to Aug. 31
August 20, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

The second Pan-European Electronics Design Conference (PEDC) will take place Jan. 21-22, 2026, in Prague, Czech Republic. The call for abstracts deadline has been extended to Aug. 31.
Organized jointly by the German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association (formerly IPC), PEDC serves as a European platform for knowledge exchange, networking, and innovation in electronics design and development.
The inaugural PEDC event was held in Vienna, Austria, in January, and the show is now set to become an annual European event. The conference features two days of lectures, keynote speeches, and networking opportunities. All PEDC presentations are peer-reviewed and non-promotional, much like the technical content at APEX EXPO in the U.S.
“The first PEDC conference in January was a resounding success, with participants from 15 European countries and five countries around the world enjoying the high-quality presentations, which were free from commercialism,” said Peter Tranitz, senior director of technology solutions for Global Electronics Association. “Our panel of technical experts will ensure that the second PEDC conference maintains this high standard. We look forward to continuing this exceptional networking event for the pan-European electronics design community and beyond.”
A presentation at the PEDC is a great way to reach your European customers. The PEDC is aimed at professionals from industry, research, and development in the field of electronics design. Show organizers Global Electronics Association and FED represent more than 3,700 companies in the electronics industry. Companies and institutions are invited to submit abstracts for technical and scientific presentations on the following topics:
- Silicon to Systems
- Design for Excellence (DfX)
- Design Software and Tools
- Sustainable Designs and Product Life Cycle
A presentation at the PEDC offers companies the opportunity to position themselves as innovation leaders and expand their network within the European electronics community. Submit your abstract today and join your colleagues in Prague next January.
Location: NH Prague City Hotel
Dates: Jan. 21-22, 2026.
Submission deadline: Aug. 31, 2025
Further information and submission portal: www.pedc.eu.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Direct Imaging System Market Size to Hit $4.30B by 2032, Driven by Increasing Demand for High-Precision PCB Manufacturing
09/11/2025 | Globe NewswireAccording to the SNS Insider, “The Direct Imaging System Market size was valued at $2.21 Billion in 2024 and is projected to reach $4.30 Billion by 2032, growing at a CAGR of 8.68% during 2025-2032.”
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Printed Electronics Market Size to Top $83.77 Billion by 2034 Driven by IoT Adoption and Flexible Device Demand
09/11/2025 | Globe NewswireThe printed electronics market size has been calculated at U$19,920 million in 2025 and is expected to grow from $23,58 million in 2026 to approximately $83,770 million by 2034.
Koh Young, Fuji, and Kurtz ERSA Drive Smart Manufacturing Solutions for EV and Automotive Electronics at Kunshan, China Technical Seminar
09/11/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, partnered with Fuji Corporation and Kurtz ERSA to host an exclusive technical seminar for leading automotive manufacturers in East China. Held on September 4 at Fuji’s factory in Kunshan, the event gathered participants representing over 35 companies.
LITEON Technology Reports Consolidated August Sales of NT$15.6 Billion, Up 13% M-o-M, 30% YoY
09/10/2025 | LITEON TechnologyLITEON Technology reported its August consolidated revenue of NT$15.6 billion. Thanks to the growth from power management in cloud computing, advanced server, and networking, the revenue is up 13% M-o-M, 30% Y-o-Y.